Goodram PRO 2x4GB DDR3 GP2400D364L11S/8GDC 产品宣传页
产品代码
GP2400D364L11S/8GDC
BYTE
DESCRIPTION
0
Number of Serial PD Bytes Written / SPD Device Size / CRC Coverage
1
SPD Revision
2
Key Byte / DRAM Device Type
3
Key Byte / Module Type
4
SDRAM Density and Banks
5
SDRAM Addressing
6
Reserved
7
Module Organization
8
Module Memory Bus Width
9
Fine Timebase Dividend and Divisor
10
Medium Timebase Dividend
11
Medium Timebase Divisor
12
SDRAM Maximum Cycle Time (tCKmax)
13
Reserved
14
CAS Latencies Supported, Least Significant Byte
15
CAS Latencies Supported, Most Significant Byte
16
Minimum CAS Latency Time(tAAmin)
17
Minimum Write Recovery Time (tWRmin)
18
Minimum RAS# to CAS# Delay Time (tRCDmin)
19
Minimum Row Active to Row Active Delay Time (tRRDmin)
20
Minimum Row Precharge Time (tRPmin)
21
Upper Nibbles for tRAS and tRC
22
Minimum Active to Precharge Time (tRASmin), Least Significant Byte
23
Minimum Active to Active/Refresh Time (tRCmin), Least Significatn
24
Minimum Refresh Recovery Time (tRFCmin), Least Significant Byte
25
Minimum Refresh Recovery Time (tRFCmin), Most Significant Byte
26
Minimum Internal Write to Read Command Delay Time (tWTRmin)
27
Minimum Internal Read to Precharge Command Delay Time (tRTPmin)
28
Upper Nibble for tFAW
29
Minimum Four Activate WIndow Delay Time (tFAWmin), Least Significa
30
SDRAM Output Drivers supported
31
SDRAM Thermal and Refresh Options
32-59
Reserved, General Section
60
Module Nominal Height
61
Module Maximum Thickness
62
Reference Raw Card Used
63
Address Mapping from Edge Connector to DRAM
64-116 Reserved
117
117
Module Manufacturer ID Code, Least Significant Byte
118
Module Manufacturer ID Code, Most Significant Byte
119
Module ID: Module Manufacturing Location
120
Module ID: Module Manufacturing Date
121
Module ID: Module Manufacturing Date
122
Module ID : Module Serial Number
123
Module ID : Module Serial Number
124
Module ID : Module Serial Number
125
Module ID : Module Serial Number
126
Cyclic Redundancy Code
127
Cyclic Redundancy Code
SPD CONFIGURATION
HEX
DEC
0x92
146
0x10
16
0x0B
11
0x02
2
0x04
4
0x21
33
0x00
0
0x01
1
0x03
3
0x52
82
0x01
1
0x08
8
0x0A
10
0x00
0
0xFC
252
0x00
0
0x69
105
0x78
120
0x69
105
0x30
48
0x69
105
0x11
17
0x18
24
0x81
129
0x20
32
0x08
8
0x3C
60
0x3C
60
0x00
0
0xF0
240
0x83
131
0x88
136
0x00
0
0x0F
15
0x11
17
0x00
0
0x00
0
0x00
0
0x07
7
0x5D
93
0x00
0
0x00
0
0x00
0
0x00
0
0x00
0
0x00
0
0x00
0
0x13
19
0xCD
205
www.goodram.com
MEMORY MODULE SPECIFICATION
GOODRAM logo is registered trademark of Wilk Elektronik S.A.
All other trademarks and logos are the property of their respective owners.
All products and specifications are subject to change without notice.
Rev. 11-02-2014
All other trademarks and logos are the property of their respective owners.
All products and specifications are subject to change without notice.
Rev. 11-02-2014
Wilk Elektronik S.A.
Poland, 43-173 £aziska Górne, ul. Miko³owska 42
tel.: 0-32/ 736 90 00, fax: 0-32/ 736 90 01
www.wilk.com.pl
Poland, 43-173 £aziska Górne, ul. Miko³owska 42
tel.: 0-32/ 736 90 00, fax: 0-32/ 736 90 01
www.wilk.com.pl
l
www.goodram.com
© Wilk Elektronik S.A. 2014
professional memory for everyone