Fujitsu Xeon S26361-F3099-E828 数据表
产品代码
S26361-F3099-E828
Intel® Xeon™ Processor with 800 MHz System Bus
22
Datasheet
At conditions exceeding absolute maximum and minimum ratings, neither functionality nor long-
term reliability can be expected. Moreover, if a device is subjected to these conditions for any
length of time then, when returned to conditions within the functional operating condition limits, it
will either not function, or its reliability will be severely degraded.
term reliability can be expected. Moreover, if a device is subjected to these conditions for any
length of time then, when returned to conditions within the functional operating condition limits, it
will either not function, or its reliability will be severely degraded.
Although the processor contains protective circuitry to resist damage from static electric discharge,
precautions should always be taken to avoid high static voltages or electric fields.
precautions should always be taken to avoid high static voltages or electric fields.
NOTES:
1. For functional operation, all processor electrical, signal quality, mechanical and thermal specifications must
be satisfied.
2. Excessive overshoot or undershoot on any signal will likely result in permanent damage to the processor.
3. Storage temperature is applicable to storage conditions only. In this scenario, the processor must not receive
3. Storage temperature is applicable to storage conditions only. In this scenario, the processor must not receive
a clock, and no pins can be connected to a voltage bias. Storage within these limits will not affect the long-
term reliability of the device. For functional operation, please refer to the processor case temperature
specifications.
term reliability of the device. For functional operation, please refer to the processor case temperature
specifications.
4. This rating applies to the processor and does not include any tray or packaging.
2.11
Processor DC Specifications
The processor DC specifications in this section are defined at the processor core (pads) unless
noted otherwise. See
noted otherwise. See
for the Intel® Xeon™ processor with 800 MHz system bus pin
listings and
. For platform power delivery planning refer to
, which provides V
CC
static and
.
BSEL[1:0] and VID[5:0] signals are specified in
. The DC specifications for the AGTL+
signals are listed in
. The DC specifications for the PWRGOOD input and TAP signal
group are listed in
.
through
meeting specifications for case temperature (T
CASE
as specified in
), clock frequency,
and input voltages. Care should be taken to read all notes associated with each parameter.
2.11.1
Flexible Motherboard Guidelines (FMB)
The Flexible Motherboard (FMB) guidelines are estimates of the maximum values the Intel®
Xeon™ processor with 800 MHz system bus will have over certain time periods. The values are
only estimates and actual specifications for future processors may differ. Processors may or may
not have specifications equal to the FMB value in the foreseeable future. System designers should
meet the FMB values to ensure their systems will be compatible with future Intel® Xeon™
processor with 800 MHz system bus.
Xeon™ processor with 800 MHz system bus will have over certain time periods. The values are
only estimates and actual specifications for future processors may differ. Processors may or may
not have specifications equal to the FMB value in the foreseeable future. System designers should
meet the FMB values to ensure their systems will be compatible with future Intel® Xeon™
processor with 800 MHz system bus.
Table 8.
Absolute Maximum and Minimum Ratings
Symbol
Parameter
Min
Max
Unit
Notes
1,2
V
CC
Core voltage with respect to V
SS
-0.30
1.55
V
V
TT
System bus termination voltage with
respect to V
respect to V
SS
-0.30
1.55
V
T
CASE
Processor case temperature
See
See
°C
T
STORAGE
Storage temperature
-40
85
°C
3, 4