Fujitsu Xeon S26361-F3099-E828 数据表
产品代码
S26361-F3099-E828
Intel® Xeon™ Processor with 800 MHz System Bus
Datasheet
71
6.1.2
Thermal Metrology
The maximum case temperatures (T
CASE
and measured at the
geometric top center of the processor integrated heat spreader (IHS).
illustrates the
location where T
CASE
temperature measurements should be made. For detailed guidelines on
temperature measurement methodology, refer to the appropriate thermal/mechanical design guide.
NOTE: Figure is not to scale and is for reference only.
6.2
Processor Thermal Features
6.2.1
Thermal Monitor
The Thermal Monitor feature helps control the processor temperature by activating the Thermal
Control Circuit (TCC) when the processor silicon reaches its maximum operating temperature. The
TCC reduces processor power consumption as needed by modulating (starting and stopping) the
internal processor core clocks. The Thermal Monitor feature must be enabled for the processor to
be operating within specifications. The temperature at which Thermal Monitor activates the
thermal control circuit is not user configurable and is not software visible. Bus traffic is snooped in
the normal manner, and interrupt requests are latched (and serviced during the time that the clocks
are on) while the TCC is active.
Control Circuit (TCC) when the processor silicon reaches its maximum operating temperature. The
TCC reduces processor power consumption as needed by modulating (starting and stopping) the
internal processor core clocks. The Thermal Monitor feature must be enabled for the processor to
be operating within specifications. The temperature at which Thermal Monitor activates the
thermal control circuit is not user configurable and is not software visible. Bus traffic is snooped in
the normal manner, and interrupt requests are latched (and serviced during the time that the clocks
are on) while the TCC is active.
When the Thermal Monitor is enabled, and a high temperature situation exists (i.e. TCC is active),
the clocks will be modulated by alternately turning the clocks off and on at a duty cycle specific to
the processor (typically 30 -50%). Clocks will not be off for more than 3 microseconds when the
TCC is active. Cycle times are processor speed dependent and will decrease as processor core
frequencies increase. A small amount of hysteresis has been included to prevent rapid active/
inactive transitions of the TCC when the processor temperature is near its maximum operating
temperature. Once the temperature has dropped below the maximum operating temperature, and
the hysteresis timer has expired, the TCC goes inactive and clock modulation ceases.
the clocks will be modulated by alternately turning the clocks off and on at a duty cycle specific to
the processor (typically 30 -50%). Clocks will not be off for more than 3 microseconds when the
TCC is active. Cycle times are processor speed dependent and will decrease as processor core
frequencies increase. A small amount of hysteresis has been included to prevent rapid active/
inactive transitions of the TCC when the processor temperature is near its maximum operating
temperature. Once the temperature has dropped below the maximum operating temperature, and
the hysteresis timer has expired, the TCC goes inactive and clock modulation ceases.
With a thermal solution designed to meet Thermal Profile A, it is anticipated that the TCC would
only be activated for very short periods of time when running the most power intensive
applications. The processor performance impact due to these brief periods of TCC activation is
expected to be so minor that it would be immeasurable. A thermal solution that is designed to
Thermal Profile B may cause a noticeable performance loss due to increased TCC activation.
Thermal Solutions that exceed Thermal Profile B will exceed the maximum temperature
only be activated for very short periods of time when running the most power intensive
applications. The processor performance impact due to these brief periods of TCC activation is
expected to be so minor that it would be immeasurable. A thermal solution that is designed to
Thermal Profile B may cause a noticeable performance loss due to increased TCC activation.
Thermal Solutions that exceed Thermal Profile B will exceed the maximum temperature
Figure 14.
Case Temperature (T
CASE
) Measurement Location
Measure from edge of processor
Measure T
at this point.
CASE
21.25 mm
[0.837 in]
21.25 mm
[0.837 in]
42.5 mm FC-mPGA4 Package