Fujitsu Xeon S26361-F3099-E828 数据表
产品代码
S26361-F3099-E828
Intel® Xeon™ Processor with 800 MHz System Bus
Datasheet
81
NOTES:
1. The heatsink in this image is for reference only, and may not represent any of the actual boxed processor
heatsinks.
2. The screws, springs, and standoffs will be captive to the heatsink. This image shows all of the components in
an exploded view.
3. It is intended that the CEK spring will ship with the baseboard and be pre-attached prior to shipping.
8.2
Mechanical Specifications
This section documents the mechanical specifications of the boxed processor.
8.2.1
Boxed Processor Heatsink Dimensions (CEK)
The boxed processor will be shipped with an unattached thermal solution. Clearance is required
around the thermal solution to ensure unimpeded airflow for proper cooling. The physical space
requirements and dimensions for the boxed processor and assembled heatsink are shown in
around the thermal solution to ensure unimpeded airflow for proper cooling. The physical space
requirements and dimensions for the boxed processor and assembled heatsink are shown in
through
through
are the mechanical drawings for the 4-pin server
board fan header and 4-pin connector used for the active CEK fan heatsink solution.
Figure 19.
Passive Intel® Xeon™ Processor with 800 MHz System Bus Thermal Solution
(2U and larger)
(2U and larger)
Heat sink
Heat sink standoffs
Heat sink screw
springs
springs
Thermal Interface
Material
Material
Heat sink
screws
screws
Motherboard
and
processor
and
processor
Chassis pan
Protective Tape
CEK spring
Heat sink
Heat sink standoffs
Heat sink screw
springs
springs
Thermal Interface
Material
Material
Heat sink
screws
screws
Motherboard
and
processor
and
processor
Chassis pan
Protective Tape
CEK spring