Intel Desktop Board D945GCNL BOXD945GCNL 用户手册
产品代码
BOXD945GCNL
Ordering Information: See the Intel Web site at www.intel.com
For the most current product information, visit developer.intel.com/design/motherbd/
For ENERGY STAR* recommended configurations, visit www.intel.com/go/energystar
For the most current product information, visit developer.intel.com/design/motherbd/
For ENERGY STAR* recommended configurations, visit www.intel.com/go/energystar
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64-bit computing on Intel architecture requires a computer system with a processor, chipset, BIOS, operating system, device drivers, and applications enabled for Intel® 64
architecture. Processors will not operate (including 32-bit operation) without an Intel 64 architecture-enabled BIOS. Performance will vary depending on your hardware and
software configurations. See http://developer.intel.com/technology/intel64/index.htm for more information.
INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL
INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL
PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL’S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY
WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES
RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. Intel
products are not intended for use in medical, life-saving, or life-sustaining applications. Intel may make changes to specifications and product descriptions at any time, without notice.
All products, dates, and figures specified are preliminary based on current expectations, and are subject to change without notice. Availability in different channels may vary.
Intel, the Intel logo, Intel. Leap ahead., the Intel. Leap ahead. logo, Intel Core, Pentium, and Celeron are trademarks of Intel Corporation in the U.S. and other countries.
*Other names and brands may be claimed as the property of others.
Copyright © 2007 Intel Corporation. All rights reserved. 0707/MS/AT/PDF
All products, dates, and figures specified are preliminary based on current expectations, and are subject to change without notice. Availability in different channels may vary.
Intel, the Intel logo, Intel. Leap ahead., the Intel. Leap ahead. logo, Intel Core, Pentium, and Celeron are trademarks of Intel Corporation in the U.S. and other countries.
*Other names and brands may be claimed as the property of others.
Copyright © 2007 Intel Corporation. All rights reserved. 0707/MS/AT/PDF
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Technical Specifications
Processor
• Intel® Core™2 Duo processor in the LGA775
package
• Intel® Pentium® Dual-Core processor in the
LGA775 package
• Intel® Pentium® D processor in the LGA775
package
• Intel® Pentium® 4 processor in the LGA775
package
• Intel® Celeron® 400 Sequence processor
in the LGA775 package
• Intel® Celeron® D processor in the LGA775
package
• Supports Intel® 64 Architecture
package
• Intel® Pentium® Dual-Core processor in the
LGA775 package
• Intel® Pentium® D processor in the LGA775
package
• Intel® Pentium® 4 processor in the LGA775
package
• Intel® Celeron® 400 Sequence processor
in the LGA775 package
• Intel® Celeron® D processor in the LGA775
package
• Supports Intel® 64 Architecture
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Chipset
Intel 945GC Express Chipset
• Intel® 945GC Express Chipset Graphics and
Memory Controller Hub
• Intel® 82801GB I/O Controller Hub (ICH7)
• Serial Peripheral Interface (SPI) Flash or
Firmware Hub (FWH)
Memory Controller Hub (MCH) for
• Intel® 945GC Express Chipset Graphics and
Memory Controller Hub
• Intel® 82801GB I/O Controller Hub (ICH7)
• Serial Peripheral Interface (SPI) Flash or
Firmware Hub (FWH)
Memory Controller Hub (MCH) for
Intel® 945GC Express Chipset
• Designed to support up to 2 GB of system
memory using DDR2 667 / 533 SDRAM Memory
Intel® ICH7 I/O Controller Hub
• One Ultra ATA 100/66 devices
• One Floppy Connector
• Four SATA (3.0 Gb/s) ports
• One PCI Express* x1 connector support
• RealTek* 10/100/1000 Network Connection
• Designed to support up to 2 GB of system
memory using DDR2 667 / 533 SDRAM Memory
Intel® ICH7 I/O Controller Hub
• One Ultra ATA 100/66 devices
• One Floppy Connector
• Four SATA (3.0 Gb/s) ports
• One PCI Express* x1 connector support
• RealTek* 10/100/1000 Network Connection
I/O Features
Integrated super I/O LPC bus controller
• Two PCI local bus slots
• One PCI Express* x16 Graphics bus slot
Integrated Intel® ICH7 controllers
• Four back-panel ports (two dual stack)
• Four additional ports (via two headers)
Integrated super I/O LPC bus controller
• Two PCI local bus slots
• One PCI Express* x16 Graphics bus slot
Integrated Intel® ICH7 controllers
• Four back-panel ports (two dual stack)
• Four additional ports (via two headers)
Firmware Hub
System BIOS
• 4 Mb Flash EEPROM with Intel® Platform
Innovation Framework for EFI Plug and Play,
IDE drive auto-configure
• Advanced configuration and power interface
V1.0b, DMI 2.0, multilingual support
• 4 Mb Flash EEPROM with Intel® Platform
Innovation Framework for EFI Plug and Play,
IDE drive auto-configure
• Advanced configuration and power interface
V1.0b, DMI 2.0, multilingual support
System Memory
Memory Capacity
• Two 240-pin DIMM connectors supporting
up to two double-sided DIMMs
Memory Types
• DDR2 667 / 533 SDRAM memory support
• Non-ECC Memory
Memory Modes
• Dual-channel operation support
Memory Voltage
up to two double-sided DIMMs
Memory Types
• DDR2 667 / 533 SDRAM memory support
• Non-ECC Memory
Memory Modes
• Dual-channel operation support
Memory Voltage
• 1.8V
Hardware Management
Hardware Management
• Processor fan speed control
• System chassis fan speed control
• Voltage and temperature sensing
• Fan sensor inputs used to monitor fan activity
• Power management support for ACPI 2.0
Expansion Capabilities
• One PCI Express* x16 graphics connector
• One PCI Express* x1 connector
• Two PCI bus add-in card connectors
Jumpers and Front-Panel Connectors
Jumpers
• Single configuration jumper design
• Jumper access for BIOS maintenance mode
Front-Panel Connectors
Front-Panel Connectors
• Reset, HD LED, Power LEDs, power on/off
• One alternate power LED header (1x3)
• Two front-panel Hi-Speed USB 2.0 headers
• Front-panel audio header
Mechanical
Board Style
• ATX 2.2 compliant
Board Size
Board Size
• 9.6” x 9.6” (24.38 cm x 24.38 cm)
Baseboard Power Requirements
Baseboard Power Requirements
• ATX12V
Environment
Operating Temperature
• 0°C to +55°C
Storage Temperature
Storage Temperature
• -40°C to +70°C
Regulations and Safety Standards
United States and Canada
CSA/UL 60950-1, First Edition
(Binational Standard)
CSA/UL 60950-1, First Edition
(Binational Standard)
Europe
(Low Voltage Directive 2006/95/EC)
EN 60950-1:2006
(Low Voltage Directive 2006/95/EC)
EN 60950-1:2006
International
IEC 60950-1:2001, First Edition
IEC 60950-1:2001, First Edition
EMC Regulations
(tested in representative chassis)
United States
FCC 47 CFR Part 15, Subpart B
FCC 47 CFR Part 15, Subpart B
Canada
ICES-003 Class B
ICES-003 Class B
Europe
(EMC Directive 2004/108/EC)
EN 55022:2006 and EN 55024:1998
(EMC Directive 2004/108/EC)
EN 55022:2006 and EN 55024:1998
Australia/New Zealand
EN 55022:2006 Class B
EN 55022:2006 Class B
Japan
VCCI V-3/04.04, V-4/03.04, Class B
VCCI V-3/04.04, V-4/03.04, Class B
South Korea
KN-22:2005 and KN-24:2005
KN-22:2005 and KN-24:2005
Taiwan
CNS 13438:2006 Class B
CNS 13438:2006 Class B
International
CISPR 22:2005 +A1:2005 +A2:2006 Class B
Environmental Compliance
CISPR 22:2005 +A1:2005 +A2:2006 Class B
Environmental Compliance
Europe
Europe RoHS (Directive 2002/95/EC)
Europe RoHS (Directive 2002/95/EC)
China
China RoHS (MII Order # 39)
China RoHS (MII Order # 39)
Lead-Free: The symbol is used to
identify electrical and electronic
assemblies and components in which
the lead (Pb) concentration level in any
identify electrical and electronic
assemblies and components in which
the lead (Pb) concentration level in any
of the raw materials and the end product is not
greater than 0.1% by weight (1000 ppm). This
symbol is also used to indicate conformance to
lead-free requirements and definitions adopted
under the European Union’s Restriction on Haz-
ardous Substances (RoHS) directive, 2002/95/EC.
greater than 0.1% by weight (1000 ppm). This
symbol is also used to indicate conformance to
lead-free requirements and definitions adopted
under the European Union’s Restriction on Haz-
ardous Substances (RoHS) directive, 2002/95/EC.