Intel 4 530 NE80546PG0801M 数据表
产品代码
NE80546PG0801M
Datasheet
79
Boxed Processor Specifications
7.3
Thermal Specifications
This section describes the cooling requirements of the fan heatsink solution used by the boxed
processor.
processor.
7.3.1
Boxed Processor Cooling Requirements
The boxed processor may be directly cooled with a fan heatsink. However, meeting the processor's
temperature specification is also a function of the thermal design of the entire system, and
ultimately the responsibility of the system integrator. The processor temperature specification is
presented in
temperature specification is also a function of the thermal design of the entire system, and
ultimately the responsibility of the system integrator. The processor temperature specification is
presented in
. The boxed processor fan heatsink is able to keep the processor temperature
within the specifications (see
) in chassis that provide good thermal management. For the
Table 31. Fan Heatsink Power and Signal Specifications
Description
Min
Typ
Max
Unit
Notes
+12 V: 12 volt fan power supply
10.2
12
13.8
V
IC: Fan current draw
740
mA
SENSE: SENSE frequency
2
pulses per fan
revolution
1
NOTES:
1.
Baseboard should pull this pin up to 5 V with a resistor.
Figure 19. Baseboard Power Header Placement Relative to Processor Socket