Texas Instruments TPS65820 Evaluation Module TPS65820EVM TPS65820EVM 数据表
产品代码
TPS65820EVM
ABSOLUTE MAXIMUM RATINGS
DISSIPATION RATINGS
SLVS663B – MAY 2006 – REVISED APRIL 2008
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over operating free-air temperature range (unless otherwise noted)
(1)
VALUE
UNIT
AC and USB with respect to AGND1
–0.3 to 18
ANLG1, ANLG2 with respect to AGND2
–0.3 to V(OUT)
V(OUT) with respect to AGND1
5
VIN_LDO12, VIN_LDO35, LDO3, LDO4, LDO5 with respect to AGND2
–0.3 to V(OUT)
LDO35_REF, ADC_REF with respect to AGND2
–0.3 to smaller of: 3.6 or V(OUT)
SIM, RTC_OUT with respect to AGND1
–0.3 to smaller of: 3.6 or V(OUT)
SM1, L1, VIN_SM1 with respect to PGND1
–0.3 to V(OUT)
V
SM2, L2, VIN_SM2 with respect to PGND2
–0.3 to V(OUT)
SM3, L3 with respect to PGND3
–0.3 to 29
SM3SW with respect to PGND3
–0.3 to V(OUT)
FB3 with respect to PGND3
–0.3 to 0.5
All other pins (except AGND and PGND), with respect to AGND1
–0.3 to V(OUT)
AGND2, AGND0, PGND1, PGND2, PGND3 with respect to AGND1
–0.3 to +0.3
Input Current, AC pin
2750
Input Current, USB pin
600
Output continuous current, OUT pin
3000
mA
Output conitnuous current, BAT pin
–3000
Continuous current at L1, PGND1, L2, PGND2
1800
T
A
Operating free-air temperature
–40 to 85
T
J
Maximum junction temperature
125
°
C
T
STG
Storage temperature
–65 to 150
Lead temperature 1,6 mm (1/16-inch) from case for 10 seconds
260
ESD rating, all pins
1.5
kV
(1)
Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
only and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
T
A
≤ 55
°
C
DERATING FACTOR
PACKAGE
θ
JA
POWER RATING
ABOVE T
A
= 55
°
C
RSH
(1) (2)
21.7
°
C/W
3.22 W
0.046 W/
°
C
(1)
This data is based on using the JEDEC High-K board and the exposed die pad is connected to a Cu
pad on the board. This is connected to the ground plane by a via matrix.
pad on the board. This is connected to the ground plane by a via matrix.
(2)
The RSH package MSL Level : HIR3 at 260
°
C
4
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