Texas Instruments THS3111 Evaluation Module THS3111EVM THS3111EVM 数据表
产品代码
THS3111EVM
0.205
(5,21)
0.060
(1,52)
0.013
(0,33)
0.017
(0,432)
0.025
(0,64)
0.094
(2,39)
0.040
(1,01)
0.035
(0,89)
0.030
(0,76)
0.075
(1,91)
0.010
vias
(0,254)
DIE
Side View (a)
DIE
End View (b)
Thermal
Pad
Bottom View (c)
SLOS422E – SEPTEMBER 2003 – REVISED OCTOBER 2009
........................................................................................................................................
www.ti.com
PowerPAD DESIGN CONSIDERATIONS
PowerPAD LAYOUT CONSIDERATIONS
1. PCB with a top side etch pattern as shown in
The THS3110 and THS3111 are available in a
. There should be etch for the leads as
thermally-enhanced PowerPAD family of packages.
well as etch for the thermal pad.
These packages are constructed using a downset
leadframe upon which the die is mounted (see
leadframe upon which the die is mounted (see
a and
b). This arrangement results
in the lead frame being exposed as a thermal pad on
the underside of the package (see
the underside of the package (see
Because this thermal pad has direct thermal contact
with the die, excellent thermal performance can be
achieved by providing a good thermal path away from
the thermal pad. Note that devices such as the
THS311x have no electrical connection between the
PowerPAD and the die.
with the die, excellent thermal performance can be
achieved by providing a good thermal path away from
the thermal pad. Note that devices such as the
THS311x have no electrical connection between the
PowerPAD and the die.
The PowerPAD package allows for both assembly
and thermal management in one manufacturing
operation. During the surface-mount solder operation
(when the leads are being soldered), the thermal pad
can also be soldered to a copper area underneath the
package. Through the use of thermal paths within this
copper area, heat can be conducted away from the
and thermal management in one manufacturing
operation. During the surface-mount solder operation
(when the leads are being soldered), the thermal pad
can also be soldered to a copper area underneath the
package. Through the use of thermal paths within this
copper area, heat can be conducted away from the
Dimensions are in inches (mm).
package into either a ground plane or other heat
dissipating device.
dissipating device.
Figure 64. DGN PowerPAD PCB Etch and
Via Pattern
The PowerPAD package represents a breakthrough
in combining the small area and ease of assembly of
in combining the small area and ease of assembly of
2. Place five holes in the area of the thermal pad.
surface
mount
with
the,
heretofore,
awkward
These holes should be 0.01 inch (0,254 mm) in
mechanical methods of heatsinking.
diameter. Keep them small so that solder wicking
through the holes is not a problem during reflow.
through the holes is not a problem during reflow.
3. Additional vias may be placed anywhere along
the thermal plane outside of the thermal pad
area. This helps dissipate the heat generated by
the THS3110/THS3111 IC. These additional vias
may be larger than the 0.01-inch (0,254 mm)
diameter vias directly under the thermal pad.
They can be larger because they are not in the
thermal pad area to be soldered so that wicking
area. This helps dissipate the heat generated by
the THS3110/THS3111 IC. These additional vias
may be larger than the 0.01-inch (0,254 mm)
diameter vias directly under the thermal pad.
They can be larger because they are not in the
thermal pad area to be soldered so that wicking
Figure 63. Views of Thermal Enhanced Package
is not a problem.
4. Connect all holes to the internal ground plane.
Although there are many ways to properly heatsink
Note that the PowerPAD is electrically isolated
the PowerPAD package, the following steps illustrate
from the silicon and all leads. Connecting the
the recommended approach.
PowerPAD to any potential voltage such as V
S–
,
is acceptable as there is no electrical connection
space
to the silicon.
space
5. When connecting these holes to the ground
plane, do not use the typical web or spoke via
space
connection methodology. Web connections have
space
a high thermal resistance connection that is
useful for slowing the heat transfer during
useful for slowing the heat transfer during
space
soldering operations. This makes the soldering of
space
vias that have plane connections easier. In this
application, however, low thermal resistance is
application, however, low thermal resistance is
space
desired for the most efficient heat transfer.
space
Therefore,
the
holes
under
the
THS3110/THS3111 PowerPAD package should
space
make their connection to the internal ground
plane with a complete connection around the
plane with a complete connection around the
space
22
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