Texas Instruments IC MCU 16B MSP430F169IPM LQFP-64 TID MSP430F169IPM 数据表
产品代码
MSP430F169IPM
MSP430F15x, MSP430F16x, MSP430F161x
MIXED SIGNAL MICROCONTROLLER
SLAS368G − OCTOBER 2002 − REVISED MARCH 2011
1
POST OFFICE BOX 655303
•
DALLAS, TEXAS 75265
D
Low Supply-Voltage Range: 1.8 V to 3.6 V
D
Ultralow Power Consumption
− Active Mode: 330
− Active Mode: 330
μ
A at 1 MHz, 2.2 V
− Standby Mode: 1.1
μ
A
− Off Mode (RAM Retention): 0.2
μ
A
D
Five Power-Saving Modes
D
Wake-Up From Standby Mode in
Less Than 6
Less Than 6
μ
s
D
16-Bit RISC Architecture,
125-ns Instruction Cycle Time
125-ns Instruction Cycle Time
D
Three-Channel Internal DMA
D
12-Bit Analog-to-Digital (A/D) Converter
With Internal Reference, Sample-and-Hold,
and Autoscan Feature
With Internal Reference, Sample-and-Hold,
and Autoscan Feature
D
Dual 12-Bit Digital-to-Analog (D/A)
Converters With Synchronization
Converters With Synchronization
D
16-Bit Timer_A With Three
Capture/Compare Registers
Capture/Compare Registers
D
16-Bit Timer_B With Three or Seven
Capture/Compare-With-Shadow Registers
Capture/Compare-With-Shadow Registers
D
On-Chip Comparator
D
Serial Communication Interface (USART0),
Functions as Asynchronous UART or
Synchronous SPI or I
Functions as Asynchronous UART or
Synchronous SPI or I
2
C
TM
Interface
D
Serial Communication Interface (USART1),
Functions as Asynchronous UART or
Synchronous SPI Interface
Functions as Asynchronous UART or
Synchronous SPI Interface
D
Supply Voltage Supervisor/Monitor With
Programmable Level Detection
Programmable Level Detection
D
Brownout Detector
D
Bootstrap Loader
I
2
C is a registered trademark of Philips Incorporated.
D
Serial Onboard Programming,
No External Programming Voltage Needed,
Programmable Code Protection by Security
Fuse
No External Programming Voltage Needed,
Programmable Code Protection by Security
Fuse
D
Family Members Include
− MSP430F155
− MSP430F155
16KB+256B Flash Memory
512B RAM
512B RAM
− MSP430F156
24KB+256B Flash Memory
1KB RAM
1KB RAM
− MSP430F157
32KB+256B Flash Memory,
1KB RAM
1KB RAM
− MSP430F167
32KB+256B Flash Memory,
1KB RAM
1KB RAM
− MSP430F168
48KB+256B Flash Memory,
2KB RAM
2KB RAM
− MSP430F169
60KB+256B Flash Memory,
2KB RAM
2KB RAM
− MSP430F1610
32KB+256B Flash Memory
5KB RAM
5KB RAM
− MSP430F1611
48KB+256B Flash Memory
10KB RAM
10KB RAM
− MSP430F1612
55KB+256B Flash Memory
5KB RAM
5KB RAM
D
Available in 64-Pin QFP Package (PM) and
64-Pin QFN Package (RTD)
64-Pin QFN Package (RTD)
D
For Complete Module Descriptions, See the
MSP430x1xx Family User’s Guide,
Literature Number SLAU049
MSP430x1xx Family User’s Guide,
Literature Number SLAU049
description
The Texas Instruments MSP430 family of ultralow power microcontrollers consist of several devices featuring
different sets of peripherals targeted for various applications. The architecture, combined with five low power
modes is optimized to achieve extended battery life in portable measurement applications. The device features
a powerful 16-bit RISC CPU, 16-bit registers, and constant generators that contribute to maximum code
efficiency.
different sets of peripherals targeted for various applications. The architecture, combined with five low power
modes is optimized to achieve extended battery life in portable measurement applications. The device features
a powerful 16-bit RISC CPU, 16-bit registers, and constant generators that contribute to maximum code
efficiency.
The digitally controlled oscillator (DCO) allows wake-up from low-power modes to active mode in less
than 6
μ
s.
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range
from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage
because very small parametric changes could cause the device not to meet its published specifications. These devices have limited
built-in ESD protection.
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range
from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage
because very small parametric changes could cause the device not to meet its published specifications. These devices have limited
built-in ESD protection.
Copyright
©
2011, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.