Texas Instruments IC MCU 16B MSP430F2111IRGET VQFN-24 TID MSP430F2111IRGET 数据表
产品代码
MSP430F2111IRGET
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
TEST
V
CC
P2.5/CA5
V
SS
XOUT/P2.7/CA7
XIN/P2.6/CA6
RST/NMI
P2.0/ACLK/CA2
P2.1/INCLK/CA3
P2.2/CAOUT/TA0/CA4
P1.7/TA2/TDO/TDI
P1.6/TA1/TDI/TCLK
P1.5/TA0/TMS
P1.4/SMCLK/TCK
P1.3/TA2
P1.2/TA1
P1.1/TA0
P1.0/TACLK
P2.4/TA2/CA1
P2.3/TA1/CA0
11
P2.4/T
A2/CA1
10
P2.3/T
A1/CA0
9
NC
8
P2.2/CA
OUT/T
A0/CA4
7
P2.1/INCLK/CA3
12
NC
5
RST/NMI
4
XIN/P2.6/CA6
3
XOUT/P2.7/CA7
2
V
SS
1
NC
6
P2.0/ACLK/CA2
14
P1.1/TA0
15
P1.2/TA1
16
P1.3/TA2
17
P1.4/SMCLK/TCK
18
P1.5/TA0/TMS
13
P1.0/TACLK
20
P1.6/T
A1/TDI/TCLK
21
P1.7/T
A2/TDO/TDI
22
TEST
23
V
CC
24
P2.5/CA5
19
NC
Exposed
Thermal Pad
MSP430F21x1
SLAS439F
–
SEPTEMBER 2004
–
REVISED AUGUST 2011
Device Pinout
DW, PW, or DGV PACKAGE
(TOP VIEW)
RGE PACKAGE
(TOP VIEW)
A.
NC = Not internally connected
B.
Exposed thermal pad connection to V
SS
recommended.
Copyright
©
2004
–
2011, Texas Instruments Incorporated
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