Microchip Technology MCP6031DM-PTPLS 数据表

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页码 34
© 2008 Microchip Technology Inc.
DS22041B-page 5
MCP6031/2/3/4
TEMPERATURE SPECIFICATIONS
1.1
Test Circuits
The test circuits used for the DC and AC tests are
shown in 
. The bypass
capacitors are laid out according to the rules discussed
in 
FIGURE 1-2:
AC and DC Test Circuit for 
Most Non-Inverting Gain Conditions.
FIGURE 1-3:
AC and DC Test Circuit for 
Most Inverting Gain Conditions.
Electrical Characteristics: Unless otherwise indicated, V
DD
 = +1.8V to +5.5V and V
SS
 = GND.
Parameters
Sym
Min
Typ
Max
Units
Conditions
Temperature Ranges
Operating Temperature Range
T
A
-40
+125
°C
Storage Temperature Range
T
A
-65
+150
°C
Thermal Package Resistances
Thermal Resistance, 5L-SOT-23
θ
JA
256
°C/W
Thermal Resistance, 8L-DFN (2x3)
θ
JA
84
°C/W
Thermal Resistance, 8L-SOIC
θ
JA
163
°C/W
Thermal Resistance, 8L-MSOP
θ
JA
206
°C/W
Thermal Resistance, 14L-SOIC
θ
JA
120
°C/W
Thermal Resistance, 14L-TSSOP
θ
JA
100
°C/W
Note:
The internal junction temperature (T
J
) must not exceed the absolute maximum specification of +150°C.
V
DD
MCP603X
R
G
R
F
R
N
V
OUT
V
IN
V
DD
/2
2.2 µF
C
L
R
L
V
L
0.1 µF
V
DD
MCP603X
R
G
R
F
R
N
V
OUT
V
IN
V
DD
/2
2.2 µF
C
L
R
L
V
L
0.1 µF