Microchip Technology MA330012 数据表

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页码 370
©
 2007 Microchip Technology Inc.
Preliminary
DS70165E-page 351
dsPIC33F
27.0
PACKAGING INFORMATION
27.1
Package Marking Information          
64-Lead TQFP (10x10x1 mm)
XXXXXXXXXX
XXXXXXXXXX
XXXXXXXXXX
YYWWNNN
Example
dsPIC33FJ
256GP706
0710017
80-Lead TQFP (12x12x1 mm)
XXXXXXXXXXXX
XXXXXXXXXXXX
YYWWNNN
Example
dsPIC33FJ128
0710017
Legend: XX...X
Customer-specific information
Y
Year code (last digit of calendar year)
YY
Year code (last 2 digits of calendar year)
WW
Week code (week of January 1 is week ‘01’)
NNN
Alphanumeric traceability code
  
Pb-free JEDEC designator for Matte Tin (Sn)
*
This package is Pb-free. The Pb-free JEDEC designator (     )
can be found on the outer packaging for this package.
Note:
In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
3
e
3
e
100-Lead TQFP (12x12x1 mm)
XXXXXXXXXXXX
XXXXXXXXXXXX
YYWWNNN
Example
dsPIC33FJ256
GP710-I/PT
0710017
GP708-I/PT
100-Lead TQFP (14x14x1mm)
XXXXXXXXXXXX
XXXXXXXXXXXX
YYWWNNN
Example
dsPIC33FJ256
GP710-I/PF
0710017
-I/PT
3
e
3
e
3
e
3
e