Kingston Technology Memory HyperX 1GB 533Mhz DDR 2pk KHX4300K2/1G 数据表
产品代码
KHX4300K2/1G
Memory Module Specification
Document No. 4803843-001.A00
01/07/04
KHX4300K2/1G
1GB (512MB 64M x 64-Bit x 2 pcs.)
PC4300 CL3 184-Pin DIMM Kit
KEYED
Page 1
DESCRIPTION:
Kingston's KHX4300K2/1G is a kit of two 64M x 64-bit (512MB) DDR533 CL3 SDRAM (Synchro-
nous DRAM) memory modules. Total kit capacity is 1GB (1024MB). The components on each module
include sixteen 32M x 8-bit (8M x 8-bit x 4 Bank) DDR533 SDRAM in TSOP packages. Each 184-
pin DIMM uses gold contact fingers and requires +2.7V. The electrical and mechanical specifications
are as follows:
nous DRAM) memory modules. Total kit capacity is 1GB (1024MB). The components on each module
include sixteen 32M x 8-bit (8M x 8-bit x 4 Bank) DDR533 SDRAM in TSOP packages. Each 184-
pin DIMM uses gold contact fingers and requires +2.7V. The electrical and mechanical specifications
are as follows:
FEATURES:
Power supply : Vdd: 2.7V ± 0.1V, Vddq: 2.7V ± 0.1V
Double-data-rate architecture; two data transfers per clock cycle
Bidirectional data strobe(DQS)
Differential clock inputs(CK and CK)
DLL aligns DQ and DQS transition with CK transition
Programmable Read latency 3 (clock)
Programmable Burst length (2, 4, 8)
Programmable Burst type (sequential & interleave)
Timing Reference: 3-4-4-8-1 at +2.7V
Edge aligned data output, center aligned data input
Auto & Self refresh, 7.8us refresh interval(8K/64ms refresh)
Serial presence detect with EEPROM
High Performance Heat Spreader
PCB : Height 1.250” (31.75mm), double sided component
Double-data-rate architecture; two data transfers per clock cycle
Bidirectional data strobe(DQS)
Differential clock inputs(CK and CK)
DLL aligns DQ and DQS transition with CK transition
Programmable Read latency 3 (clock)
Programmable Burst length (2, 4, 8)
Programmable Burst type (sequential & interleave)
Timing Reference: 3-4-4-8-1 at +2.7V
Edge aligned data output, center aligned data input
Auto & Self refresh, 7.8us refresh interval(8K/64ms refresh)
Serial presence detect with EEPROM
High Performance Heat Spreader
PCB : Height 1.250” (31.75mm), double sided component
PERFORMANCE:
Clock Cycle Time (tCK)
4ns (min.) / 10ns (max.)
Row Cycle Time (tRC)
55ns (min.)
Refresh Row Cycle Time (tRFC) 70ns (min.)
Row Active Time (tRAS)
Row Active Time (tRAS)
40ns (min.) / 70,000ns (max.)
Power (IDD0)
8.000 W (max. per module)
UL Rating
94 V - 0
Operating Temperature
0
o
C to 70
o
C
Storage Temperature
-55
o
C to +125
o
C