Freescale Semiconductor Demo Board for MMA8491Q Xtrinsic 3-Axis Accelerometer DEMOMMA8491 DEMOMMA8491 用户手册
产品代码
DEMOMMA8491
Freescale Semiconductor
Document Number: AN4292
Application Note
Rev 0, 10/2012
© 2012 Freescale Semiconductor, Inc. All rights reserved.
Contents
DEMOMMA8491 Xtrinsic
Accelerometer Evaluation Kit
Accelerometer Evaluation Kit
by: FengYi Li
Applications Engineer
This application note provides an overview of the
Xtrinsic DEMOMMA8491 kit and its evaluation
guidelines.
Xtrinsic DEMOMMA8491 kit and its evaluation
guidelines.
The DEMOMMA8491 kit contains two boards:
•
Demo board: provides a tamper detection sensor
demonstration using the Xtrinsic MMA8491Q
45° tilt sensor and 3-axis accelerometer, housed
in a transparent plastic case.
demonstration using the Xtrinsic MMA8491Q
45° tilt sensor and 3-axis accelerometer, housed
in a transparent plastic case.
•
Breakout board: provides easy access to every
pin of the QFN sensor for evaluation.
pin of the QFN sensor for evaluation.
This document describes board functionality and
features, how to use these boards, and what to look for
when evaluating the devices. The last section provides
reference schematics and the bills of materials.
features, how to use these boards, and what to look for
when evaluating the devices. The last section provides
reference schematics and the bills of materials.
DEMOMMA8491 Demo Board . . . . . . . . . . . . . . . . . . . . 2
1.1 Acceleration directions . . . . . . . . . . . . . . . . . . . . . . 2
1.2 Using the demo board . . . . . . . . . . . . . . . . . . . . . . . 2
1.3 Acceleration values are cumulative . . . . . . . . . . . . . 3
1.1 Acceleration directions . . . . . . . . . . . . . . . . . . . . . . 2
1.2 Using the demo board . . . . . . . . . . . . . . . . . . . . . . . 2
1.3 Acceleration values are cumulative . . . . . . . . . . . . . 3
DEMOMMA8491 Breakout Board . . . . . . . . . . . . . . . . . . 4
2.1 Pin map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
2.2 Suggested application connections . . . . . . . . . . . . . 5
2.3 Soldering considerations . . . . . . . . . . . . . . . . . . . . . 5
2.4 Evaluating performance. . . . . . . . . . . . . . . . . . . . . . 6
2.1 Pin map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
2.2 Suggested application connections . . . . . . . . . . . . . 5
2.3 Soldering considerations . . . . . . . . . . . . . . . . . . . . . 5
2.4 Evaluating performance. . . . . . . . . . . . . . . . . . . . . . 6
Schematics and Bill of Materials (BOM) . . . . . . . . . . . . . 6
3.1 Demo board schematic . . . . . . . . . . . . . . . . . . . . . . 6
3.2 Demo board BOM . . . . . . . . . . . . . . . . . . . . . . . . . . 6
3.3 Breakout board schematic. . . . . . . . . . . . . . . . . . . . 7
3.4 Breakout board BOM. . . . . . . . . . . . . . . . . . . . . . . . 7
3.1 Demo board schematic . . . . . . . . . . . . . . . . . . . . . . 6
3.2 Demo board BOM . . . . . . . . . . . . . . . . . . . . . . . . . . 6
3.3 Breakout board schematic. . . . . . . . . . . . . . . . . . . . 7
3.4 Breakout board BOM. . . . . . . . . . . . . . . . . . . . . . . . 7