Freescale Semiconductor Evaluation Kit for MM912H634 with Integrated S12 Based Relay Driver and LIN KIT912H634EVME KIT912H634EVME 用户手册
产品代码
KIT912H634EVME
Freescale Semiconductor
Advance Information
Advance Information
Document Number: MM912_634D1
Rev. 10.0, 1/2013
© Freescale Semiconductor, Inc., 2010-2013. All rights reserved.
This document contains certain information on a new product. Specifications and information
herein are subject to change without notice.
herein are subject to change without notice.
Integrated S12 Based Relay
Driver with LIN
Driver with LIN
The MM912G634 (48 kB) and MM912H634 (64 kB) are
integrated single package solutions that integrate an HCS12
microcontroller with a SMARTMOS analog control IC. The Die
to Die Interface (D2D) controlled analog die combines system
base chip and application specific functions, including a LIN
transceiver.
Features
integrated single package solutions that integrate an HCS12
microcontroller with a SMARTMOS analog control IC. The Die
to Die Interface (D2D) controlled analog die combines system
base chip and application specific functions, including a LIN
transceiver.
Features
• 16-Bit S12 CPU, 64/48 kByte P-FLASH,
• 6.0 kByte RAM; 4/2 kByte D-FLASH
• Background debug (BDM) & debug module (DBG)
• Die to Die bus interface for transparent memory mapping
• On-chip oscillator & two independent watchdogs
• LIN 2.1 Physical Layer Interface with integrated SCI
• 10 digital MCU GPIOs shared with SPI (PA7…0, PE1…0)
• 10-Bit, 15 Channel - Analog to Digital Converter (ADC)
• 16-Bit, 4 Channel - Timer Module (TIM16B4C)
• 8-Bit, 2 Channel - Pulse width modulation module (PWM)
• 6.0 kByte RAM; 4/2 kByte D-FLASH
• Background debug (BDM) & debug module (DBG)
• Die to Die bus interface for transparent memory mapping
• On-chip oscillator & two independent watchdogs
• LIN 2.1 Physical Layer Interface with integrated SCI
• 10 digital MCU GPIOs shared with SPI (PA7…0, PE1…0)
• 10-Bit, 15 Channel - Analog to Digital Converter (ADC)
• 16-Bit, 4 Channel - Timer Module (TIM16B4C)
• 8-Bit, 2 Channel - Pulse width modulation module (PWM)
• Six high voltage / Wake-up inputs (L5…0)
• Three low voltage GPIOs (PB2…0)
• Low power modes with cyclic sense & forced wake-up
• Current sense module with selectable gain
• Reverse battery protected voltage sense module
• Two protected low side outputs to drive inductive loads
• Two protected high side outputs
• Chip temperature sensor
• Hall sensor supply & integrated voltage regulator(s)
• Three low voltage GPIOs (PB2…0)
• Low power modes with cyclic sense & forced wake-up
• Current sense module with selectable gain
• Reverse battery protected voltage sense module
• Two protected low side outputs to drive inductive loads
• Two protected high side outputs
• Chip temperature sensor
• Hall sensor supply & integrated voltage regulator(s)
Figure 1. Simplified Application Diagram
ORDERING INFORMATION
See Page 2.
MM912_634
48-PIN LQFP, 7.0 mm x 7.0 mm
AE SUFFIX: Exposed Pad Option
AP SUFFIX: Non Exposed Pad Option
AE SUFFIX: Exposed Pad Option
AP SUFFIX: Non Exposed Pad Option
MM912_634
VSENSE
VS1
VS2
VS1
VS2
LIN
VDD
AGND
RESET
RESET_A
PA0/MISO
RESET_A
PA0/MISO
LS1
LS2
ISENSEH*
HS1
HS2*
TEST_A
LGND
Battery Sense
L1
M
TCLK
L2
L3
L4*
ISENSEL*
PGND
L0
L5*
Hall Sensor
HSUP
Hall Sensor
PTB0/AD0/RX/TIM0CH0
PTB1/AD1/TX/TIM0CH1
PTB2/AD2/PWM/TIM0CH2
PA1/MOSI
PA2/SCK
PA3/SS
PA4
PA5
PA6
PA7
PA2/SCK
PA3/SS
PA4
PA5
PA6
PA7
BKGD/MODC
PE0/EXTAL
PE0/EXTAL
PE1/XTAL
TEST
TEST
ADC25
VDDD2D
VDDX
VDDRX
DGND
VDDX
VDDRX
DGND
VSSRX
VSSD2D
Power Supply
LIN Interface
ADC Supply
2.5 V Suppy
5.0 V Supply
Digital Ground
Reset
5.0 V Digital I/O
Debug and External
Oscillator
MCU Test
* Feature not availablre in all Analog Options
Low Side Drivers
Current Sense Moe
Hall Sensor Supply
5.0 V GPI/O with optional
pull-up (shared with ADC,
pull-up (shared with ADC,
PWM, Timer, and SCI)
12 V Light/LED and
Switch Supply
Analog/Digita inputs
(High Voltage and Wake-up
capable)
Analog Test