Intel 2.80 GHz BX80546KG2800EA 数据表

35

 includes a list of guidelines on a package handling in terms of recommended maximum 

loading on the processor IHS relative to a fixed substrate. These package handling loads may be 
experienced during heatsink removal.

1. A shear load is defined as a load applied to the IHS in a direction parallel to the IHS top surface.
2. A tensile load is defined as a pulling load applied to the IHS in a direction normal to the IHS surface.
3. A torque load is defined as a twisting load applied to the IHS in an axis of rotation normal to the IHS top 

surface.

4. These guidelines are based on limited testing for design characterization and incidental applications (one 

time only).

5. Handling guidelines are for the package only and do not include the limits of the processor socket.

The Intel® Xeon™ processor with 800 MHz system bus can be inserted and removed 15 times 
from an mPGA604 socket, which meets the criteria outlined in the mPGA604 Socket Design 
Guidelines.

The typical mass of the Intel® Xeon™ processor with 800 MHz system bus is 25 grams [0.88 oz.]. 
This mass [weight] includes all components which make up the entire processor product.

The Intel® Xeon™ processor with 800 MHz system bus is assembled from several components. 
The basic material properties are described in 

.

Shear

356 N

80 lbf

1, 4, 5

Tensile

156 N

35 lbf

2, 4, 5

Torque

8 N-m

70 lbf-in

3, 4, 5

Integrated Heat Spreader (IHS)

Nickel over copper

Substrate

Fiber-reinforced resin

Substrate Pins

Gold over nickel