Analog Devices AD9609 Evaluation Board AD9609-40EBZ AD9609-40EBZ 数据表
产品代码
AD9609-40EBZ
AD9609
Rev. 0 | Page 31 of 32
APPLICATIONS INFORMATION
DESIGN GUIDELINES
Before starting design and layout of the AD9609 as a system,
it is recommended that the designer become familiar with these
guidelines, which discuss the special circuit connections and
layout requirements needed for certain pins.
it is recommended that the designer become familiar with these
guidelines, which discuss the special circuit connections and
layout requirements needed for certain pins.
Power and Ground Recommendations
When connecting power to the AD9609, it is strongly recom-
mended that two separate supplies be used. Use one 1.8 V supply
for analog (AVDD); use a separate 1.8 V to 3.3 V supply for the
digital output supply (DRVDD). If a common 1.8 V AVDD and
DRVDD supply must be used, the AVDD and DRVDD domains
must be isolated with a ferrite bead or filter choke and separate
decoupling capacitors. Several different decoupling capacitors
can be used to cover both high and low frequencies. Locate
these capacitors close to the point of entry at the PCB level
and close to the pins of the part, with minimal trace length.
mended that two separate supplies be used. Use one 1.8 V supply
for analog (AVDD); use a separate 1.8 V to 3.3 V supply for the
digital output supply (DRVDD). If a common 1.8 V AVDD and
DRVDD supply must be used, the AVDD and DRVDD domains
must be isolated with a ferrite bead or filter choke and separate
decoupling capacitors. Several different decoupling capacitors
can be used to cover both high and low frequencies. Locate
these capacitors close to the point of entry at the PCB level
and close to the pins of the part, with minimal trace length.
A single PCB ground plane should be sufficient when using the
AD9609. With proper decoupling and smart partitioning of the
PCB analog, digital, and clock sections, optimum performance
is easily achieved.
AD9609. With proper decoupling and smart partitioning of the
PCB analog, digital, and clock sections, optimum performance
is easily achieved.
Exposed Paddle Thermal Heat Sink Recommendations
The exposed paddle (Pin 0) is the only ground connection for
the AD9609; therefore, it must be connected to analog ground
(AGND) on the customer’s PCB. To achieve the best electrical
and thermal performance, mate an exposed (no solder mask)
continuous copper plane on the PCB to the AD9609 exposed
paddle, Pin 0.
the AD9609; therefore, it must be connected to analog ground
(AGND) on the customer’s PCB. To achieve the best electrical
and thermal performance, mate an exposed (no solder mask)
continuous copper plane on the PCB to the AD9609 exposed
paddle, Pin 0.
The copper plane should have several vias to achieve the
lowest possible resistive thermal path for heat dissipation to
flow through the bottom of the PCB. Fill or plug these vias
with nonconductive epoxy.
lowest possible resistive thermal path for heat dissipation to
flow through the bottom of the PCB. Fill or plug these vias
with nonconductive epoxy.
To maximize the coverage and adhesion between the ADC and
the PCB, a silkscreen should be overlaid to partition the continuous
plane on the PCB into several uniform sections. This provides
several tie points between the ADC and the PCB during the reflow
process. Using one continuous plane with no partitions guarantees
only one tie point between the ADC and the PCB. For detailed
information about packaging and PCB layout of chip scale
packages, see the AN-772 Application Note, A Design and
Manufacturing Guide for the Lead Frame Chip Scale Package
(LFCSP) at
the PCB, a silkscreen should be overlaid to partition the continuous
plane on the PCB into several uniform sections. This provides
several tie points between the ADC and the PCB during the reflow
process. Using one continuous plane with no partitions guarantees
only one tie point between the ADC and the PCB. For detailed
information about packaging and PCB layout of chip scale
packages, see the AN-772 Application Note, A Design and
Manufacturing Guide for the Lead Frame Chip Scale Package
(LFCSP) at
.
Encode Clock
For optimum dynamic performance a low jitter encode clock
source with a 50% duty cycle ±5% should be used to clock the
AD9609.
source with a 50% duty cycle ±5% should be used to clock the
AD9609.
VCM
The VCM pin should be decoupled to ground with a 0.1 μF
capacitor, as shown in Figure 38.
capacitor, as shown in Figure 38.
RBIAS
The AD9609 requires that a 10 kΩ resistor be placed between
the RBIAS pin and ground. This resistor sets the master current
reference of the ADC core and should have at least a 1% tolerance.
the RBIAS pin and ground. This resistor sets the master current
reference of the ADC core and should have at least a 1% tolerance.
Reference Decoupling
Externally decoupled the VREF pin to ground with a low ESR,
1.0 μF capacitor in parallel with a low ESR, 0.1 μF ceramic
capacitor.
1.0 μF capacitor in parallel with a low ESR, 0.1 μF ceramic
capacitor.
SPI Port
The SPI port should not be active during periods when the full
dynamic performance of the converter is required. Because the
SCLK, CSB, and SDIO signals are typically asynchronous to the
ADC clock, noise from these signals can degrade converter
performance. If the on-board SPI bus is used for other devices,
it may be necessary to provide buffers between this bus and the
AD9609 to keep these signals from transitioning at the converter
inputs during critical sampling periods.
dynamic performance of the converter is required. Because the
SCLK, CSB, and SDIO signals are typically asynchronous to the
ADC clock, noise from these signals can degrade converter
performance. If the on-board SPI bus is used for other devices,
it may be necessary to provide buffers between this bus and the
AD9609 to keep these signals from transitioning at the converter
inputs during critical sampling periods.