Analog Devices ADP1878 Evaluation Board ADP1878-0.6-EVALZ ADP1878-0.6-EVALZ 数据表
产品代码
ADP1878-0.6-EVALZ
Data
Sheet
ADP1878/ADP1879
Rev. B | Page 39 of 40
PACKAGING AND ORDERING INFORMATION
OUTLINE DIMENSIONS
Figure 96. 14-Lead Lead Frame Chip Scale Package [LFCSP_WD]
4 mm × 3 mm Body, Very Very Thin Dual
(CP-14-2)
Dimensions shown in millimeters
1013
09-
A
COMPLIANT
TO JEDEC STANDARDS MO-229-WEGD
BOTTOM VIEW
TOP VIEW
END VIEW
SIDE VIEW
1
7
8
14
SEATING
PLANE
0.80
0.75
0.70
0.75
0.70
0.30
0.25
0.20
0.25
0.20
0.05 MAX
0.02 NOM
0.02 NOM
0.15 REF
0.10
REF
REF
0.90
REF
REF
0.30
REF
REF
0.50 BSC
COPLANARITY
0.08
PIN 1 INDICATOR
(LASER MARKING)
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
EXPOSED
PAD
0.50
0.40
0.30
0.40
0.30
1.80
1.70
1.55
1.70
1.55
3.40
3.30
3.15
3.30
3.15
3.10
3.00
2.90
3.00
2.90
4.10
4.00
3.90
4.00
3.90
0.20 MIN