Linear Technology LTM4624Y Demo Board, 14V, 4A Step-Down µModule Regulator DC1889A DC1889A 数据表
产品代码
DC1889A
LTM4624
24
4624fb
For more information
www.linear.com/LTM4624
PACKAGE DESCRIPTION
Please refer to
http://www.linear.com/designtools/packaging/
for the most recent package drawings.
PACKAGE TOP VIEW
4
PIN “A1” CORNER
Y
X
aaa Z
aaa Z
DET
AIL A
PACKAGE BOT
TOM VIEW
3
SEE NOTES
SUGGESTED PCB LA
YOUT
TOP VIEW
0.000
2.540
1.270
1.270
2.540
2.540
1.270
2.540
1.270
0.3175
0.3175
0.3175
0.000
E
D
C
B
A
1
2
3
4
5
PIN 1
NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994
2. ALL DIMENSIONS ARE IN MILLIMETERS
BALL DESIGNA
TION PER JESD MS-028 AND JEP95
5. PRIMAR
Y DA
TUM -Z- IS SEA
TING PLANE
6. SOLDER BALL COMPOSITION IS 96.5% Sn/3.0% Ag/0.5% Cu
4
3
DET
AILS OF PIN #1 IDENTIFIER ARE OP
TIONAL,
BUT MUST BE LOCA
TED WITHIN THE ZONE INDICA
TED.
THE PIN #1 IDENTIFIER MA
Y BE EITHER A MOLD OR
MARKED FEA
TURE
Øb (25 PLACES)
A
DET
AIL B
PACKAGE SIDE VIEW
Z
M
X
Y
Z
ddd
M
Z
eee
A2
D
E
e
b
F
G
DET
AIL A
0.3175
0.3175
BGA 25 1112 REV A
LTMXXXXXX µModule
TRA
Y PIN 1 BEVEL
PACKAGE IN TRA
Y LOADING ORIENT
ATION
COMPONENT
PIN “A1”
BGA Package
25-Lead (6.25mm
×
6.25mm
×
5.01mm)
(Reference LTC DWG # 05-08-1905 Rev A)
DET
AIL B
SUBSTRA
TE
A1
b1
ccc Z
MOLD CAP
SYMBOL
A
A1
A2
b
b1
D
E
e
F
G
H1
H2
aaa
bbb
ccc
ddd
eee
MIN
4.81
0.50
4.31
0.60
0.60
0.36
3.95
NOM
5.01
0.60
4.41
0.75
0.63
6.25
6.25
1.27
5.08
5.08
0.41
4.00
MAX
5.21
0.70
4.51
0.90
0.66
0.46
4.05
0.15
0.10
0.20
0.30
0.15
NOTES
DIMENSIONS
TOT
AL NUMBER OF BALLS: 25
// bbb Z
Z
H2
H1
7
PACKAGE ROW AND COLUMN LABELING MA
Y V
AR
Y
AMONG µModule PRODUCTS. REVIEW EACH P
ACKAGE
LA
YOUT CAREFULL
Y
!
7
SEE NOTES