Linear Technology LTC2655-H16 Quad I2C 16-bit Voltage Output DAC with 2.048V Reference, req DC590 DC1703A-B DC1703A-B 数据表

LTC2655

27

2655f

Information furnished by Linear Technology Corporation is believed to be accurate and reliable. 
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.

× 4mm) Plastic QFN

(Reference LTC DWG # 05-08-1710 Rev A)

4.00 

± 0.10

4.00 

± 0.10

NOTE:
1. DRAWING IS PROPOSED TO BE MADE A JEDEC PACKAGE OUTLINE MO-220 
    VARIATION (WGGD-1)—TO BE APPROVED
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE 
    MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
    ON THE TOP AND BOTTOM OF PACKAGE 

PIN 1
TOP MARK
(NOTE 6)

0.40 

± 0.10

20

19

1

2

BOTTOM VIEW—EXPOSED PAD

2.00 REF

2.45 

± 0.10

0.75 

± 0.05

R = 0.115

TYP

R = 0.05

TYP

0.25 

± 0.05

0.50 BSC

0.200 REF

0.00 – 0.05

(UF20) QFN 01-07 REV A

RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS

APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED

0.70 

±0.05

0.25 

±0.05

0.50 BSC

2.00 REF

2.45 

± 0.05

3.10 

± 0.05

4.50 

± 0.05

PACKAGE OUTLINE

PIN 1 NOTCH
R = 0.20 TYP
OR 0.35 

× 45°

CHAMFER

2.45 

± 0.10

2.45 

± 0.05