Nxp Semiconductors BU2527DX BU Transistor NPN SOT 399 (TOP 3D) 12A 800V BU2527DX 数据表

产品代码
BU2527DX
下载
页码 8
Philips Semiconductors
Product specification
 Silicon Diffused Power Transistor
BU2527DX 
GENERAL DESCRIPTION
New generation, high-voltage, high-speed switching npn transistor with integrated damper diode in a plastic
full-pack envelope intended for use in horizontal deflection circuits of high resolution monitors. Features improved
RBSOA performance.
QUICK REFERENCE DATA
SYMBOL
PARAMETER
CONDITIONS
TYP.
MAX.
UNIT
V
CESM
Collector-emitter voltage peak value
V
BE
 = 0 V
-
1500
V
V
CEO
Collector-emitter voltage (open base)
-
800
V
I
C
Collector current (DC)
-
12
A
I
CM
Collector current peak value
-
30
A
P
tot
Total power dissipation
T
hs
 
 25 ˚C
-
45
W
V
CEsat
Collector-emitter saturation voltage
I
C
 = 8.0 A; I
B
 = 1.6 A
-
5.0
V
I
Csat
Collector saturation current
f = 64 kHz
6.0
-
A
t
s
Storage time
I
Csat
 = 6.0 A; f = 64 kHz
1.7
2.0
µ
s
PINNING - SOT399
PIN CONFIGURATION
SYMBOL
PIN
DESCRIPTION
1
base
2
collector
3
emitter
case isolated
LIMITING VALUES
Limiting values in accordance with the Absolute Maximum Rating System (IEC 134)
SYMBOL
PARAMETER
CONDITIONS
MIN.
MAX.
UNIT
V
CESM
Collector-emitter voltage peak value
V
BE
 = 0 V
-
1500
V
V
CEO
Collector-emitter voltage (open base)
-
800
V
I
C
Collector current (DC)
-
12
A
I
CM
Collector current peak value
-
30
A
I
B
Base current (DC)
-
8
A
I
BM
Base current peak value
-
12
A
-I
B(AV)
Reverse base current
average over any 20 ms period
-
200
mA
-I
BM
Reverse base current peak value 
1
-
7
A
P
tot
Total power dissipation
T
hs
 
  25 ˚C
-
45
W
T
stg
Storage temperature
-65
150
˚C
T
j
Junction temperature
-
150
˚C
THERMAL RESISTANCES
SYMBOL
PARAMETER
CONDITIONS
TYP.
MAX.
UNIT
R
th j-hs
Junction to heatsink
without heatsink compound
-
3.7
K/W
R
th j-hs
Junction to heatsink
with heatsink compound
-
2.8
K/W
R
th j-a
Junction to ambient
in free air
35
-
K/W
case
1 2 3
b
c
e
Rbe
Turn-off current.
September 1997
1
Rev 1.200