Kingston Technology Memory HyperX 512GB 533Mhz DDR2 2pk KHX4300D2K2/512 产品宣传页
产品代码
KHX4300D2K2/512
Memory Module Specification
Document No. 4804022-001.A00
08/11/04
KHX4300D2K2/512
512MB (256MB 32M x 64-Bit x 2 pcs.)
PC2-4300 CL3 240-Pin DIMM Kit
KEYED
Page 1
DESCRIPTION:
Kingston's KHX4300D2K2/512 is a kit of two 32M x 64-bit (256MB) DDR2-533 CL3 SDRAM
(Synchronous DRAM) memory modules, based on four 32M x 16-bit DDR2 FBGA components (per
module). Total kit capacity is 512MB. Each pair has been tested to run at DDR2 533MHz at low
latency timing of 3-3-3-10 at 1.85V. The SPDs are programmed to JEDEC standard latency timing
of 4-4-4-12 at 1.8V. Each 240-pin DIMM uses gold contact fingers and requires +1.8V. The
electrical and mechanical specifications are as follows:
(Synchronous DRAM) memory modules, based on four 32M x 16-bit DDR2 FBGA components (per
module). Total kit capacity is 512MB. Each pair has been tested to run at DDR2 533MHz at low
latency timing of 3-3-3-10 at 1.85V. The SPDs are programmed to JEDEC standard latency timing
of 4-4-4-12 at 1.8V. Each 240-pin DIMM uses gold contact fingers and requires +1.8V. The
electrical and mechanical specifications are as follows:
FEATURES:
Power supply : Vdd: 1.8V ± 0.1V, Vddq: 1.8V ± 0.1V
Double-data-rate architecture; two data transfers per clock cycle
Bidirectional data strobe(DQS)
Differential clock inputs(CK and CK)
DLL aligns DQ and DQS transition with CK transition
Programmable Read latency 3 (clock)
Burst Length: 4, 8 (Interleave/nibble sequential)
Programmable Burst type (sequential & interleave)
Timing Reference: 3-3-3-10 at +1.85V
Edge aligned data output, center aligned data input
Auto & Self refresh, 7.8us refresh interval (8K/64ms refresh)
Serial presence detect with EEPROM
High Performance Heat Spreader
PCB : Height 1.180” (30.00mm), single sided component
Double-data-rate architecture; two data transfers per clock cycle
Bidirectional data strobe(DQS)
Differential clock inputs(CK and CK)
DLL aligns DQ and DQS transition with CK transition
Programmable Read latency 3 (clock)
Burst Length: 4, 8 (Interleave/nibble sequential)
Programmable Burst type (sequential & interleave)
Timing Reference: 3-3-3-10 at +1.85V
Edge aligned data output, center aligned data input
Auto & Self refresh, 7.8us refresh interval (8K/64ms refresh)
Serial presence detect with EEPROM
High Performance Heat Spreader
PCB : Height 1.180” (30.00mm), single sided component
PERFORMANCE:
Clock Cycle Time (tCK) CL=3
5ns (min.) / 8ns (max.)
Row Cycle Time (tRC)
60ns (min.)
Refresh to Active/Refresh Command Time (tRFC)
105ns
Row Active Time (tRAS)
45ns (min.) / 70,000ns (max.)
Single Power Supply of
+1.8V (+/- .1V)
Power
0.864 W (operating per module)
UL Rating
94 V - 0
Operating Temperature
0
o
C to 55
o
C
Storage Temperature
-55
o
C to +125
o
C
T E C H N O L O G Y