Bourns PTC fuse Current I(H) 1.36 A 16 V (L x W x H) 7.98 x 5.44 x 3 mm MF-SMHT136-2 1 pc(s) MF-SMHT136-2 数据表

Specifi cations are subject to change without notice.
Customers should verify actual device performance in their specifi c applications.

MF-SMHT SERIES, REV. F, 02/12

The Time to Trip curves represent typical performance of a device in a simulated application environment. Actual performance in specifi c customer 
applications may differ from these values due to the infl uence of other variables.

• Recommended 

refl ow methods: IR, vapor phase oven, hot air oven.

• 

Devices are not designed to be wave soldered to the bottom side of 

 the 

board.

• 

Gluing the devices is not recommended.

• 

Recommended maximum paste thickness is 0.25  mm (.010 inch).

• 

Devices can be cleaned using standard industry methods and 

 solvents.

• If 

refl ow temperatures exceed the recommended profi le, devices 

 

may not meet the performance requirements.

• 

A device should not be reworked.

0.01 

0.1 

0.001 

1

10

100

1

10

Fault Current  (Amps)

Time to Trip (Seconds)

MF-SMHT136

MF-SMHT160

160–220

300

250

200

150

100

50

0

10–20

Temperature (

°

C)

120

Time (seconds)