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  4. PTC fuse Current I(H) 0.1 A 30 V (L x W x H) 3.43 x 2.8 x 1.1 mm MF-USMF010-2 1 pc(s)
  5. 数据表

Bourns PTC fuse Current I(H) 0.1 A 30 V (L x W x H) 3.43 x 2.8 x 1.1 mm MF-USMF010-2 1 pc(s) MF-USMF010-2 数据表

产品代码
MF-USMF010-2
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Specifi cations are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specifi c applications.
 
MF-USMF Series - PTC Resettable Fuses
Product Dimensions
DIMENSIONS:
 MM
 (INCHES)
Model
A
B
C
D
Min.
Max.
Min.
Max.
Min.
Max.
Min.
MF-USMF005
3.00
(0.118)
3.43
(0.135)
2.35
(0.093)
2.80
(0.110)
0.80
(0.031)
1.1
(0.043)
0.30
(0.012)
MF-USMF010
3.00
(0.118)
3.43
(0.135)
2.35
(0.093)
2.80
(0.110)
0.80
(0.031)
1.1
(0.043)
0.30
(0.012)
MF-USMF020
3.00
(0.118)
3.43
(0.135)
2.35
(0.093)
2.80
(0.110)
0.80
(0.031)
1.1
(0.043)
0.30
(0.012)
MF-USMF035
3.00
(0.118)
3.43
(0.135)
2.35
(0.093)
2.80
(0.110)
0.55
(0.022)
0.85
(0.033)
0.30
(0.012)
MF-USMF050
3.00
(0.118)
3.43
(0.135)
2.35
(0.093)
2.80
(0.110)
0.55
(0.022)
0.85
(0.033)
0.30
(0.012)
MF-USMF075
3.00
(0.118)
3.43
(0.135)
2.35
(0.093)
2.80
(0.110)
0.55
(0.022)
0.85
(0.033)
0.30
(0.012)
MF-USMF110
3.00
(0.118)
3.43
(0.135)
2.35
(0.093)
2.80
(0.110)
0.55
(0.022)
0.85
(0.033)
0.30
(0.012)
MF-USMF150
3.00
(0.118)
3.43
(0.135)
2.35
(0.093)
2.80
(0.110)
0.40
(0.016)
0.85
(0.033)
0.30
(0.012)
MF-USMF175X
3.00
(0.118)
3.43
(0.135)
2.35
(0.093)
2.80
(0.110)
0.40
(0.016)
0.85
(0.033)
0.30
(0.012)
Packaging: 3000 pcs. per reel. 
Terminal material:
 
Electroless Ni under immersion Au 
Termination pad solderability:
 Standard 
Au 
fi 
nish:
 
Meets ANSI/J-STD-002 Category 2.
Recommended Storage:
 
40 °C max./70 % RH max.
A
B
C
Top and Bottom View
Side View
D
160–220
300
250
200
150
100
50
0
10–20
Temperature (
°
C)
120
Preheating
Soldering
Cooling
Time (seconds)
Solder Refl ow Recommendations
Notes:
• 
MF-USMF models cannot be wave soldered.
• If 
refl ow temperatures exceed the recommended profi le, 
 
devices may not meet the performance requirements.
• 
Compatible with Pb and Pb-free solder refl ow profi les.
• 
Excess solder may cause a short circuit, especially during hand 
 
soldering. Please refer to the Multifuse
®
 Polymer PTC Soldering 
 Recommendation 
guidelines.
Recommended Pad Layout
2.5 ± 0.1
(.098  ± .004)
2.0 ± 0.1
(.079 ± .004)
1.0 ± 0.05
(.039 ± .002)
1.0 ± 0.05
(.039 ± .002)