Bourns Multifuse cutoffs 63 V (L x W x H) 3.1 x 1.55 x 0.6 mm SF-1206F050-2 1 pc(s) SF-1206F050-2 数据表

产品代码
SF-1206F050-2
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页码 4
 Portable memory
 LCD monitors
 Disk drives
 PDAs
 Digital cameras
 DVDs
 Cell phones
  Rechargeable battery packs
 Battery chargers
  Set top boxes
 Industrial controllers
 
SF-1206F Series - Fast Acting Surface Mount Fuses
Solder Refl ow Recommendations
Peak: 250 +0/-5 °C
230 °C or higher
PRE-HEATING ZONE
SOLDERING ZONE
HEATING TIME
180 °C
250
200
150
TEMPERA
TURE (°C)
100
50
150 °C
90 ± 30 Seconds
30 ± 10 Seconds
PEAK:  250 +0/-5 °C, 5 seconds
PRE-HEATING ZONE: 150 to 180 °C, 90 ± 30 seconds
SOLDERING ZONE: 230 °C or higher, 30 ± 10 seconds
Product Dimensions
Recommended Pad Layout
DIMENSIONS:
 MM
 (INCHES)
Thermal Derating Curve
120
110
100
90
80
-20
0
20
40
AMBIENT TEMPERATURE (°C)
PERCENT OF RA
TING (%)
60
80
100
120
Construction & Material Content
OVERCOAT
Sn PLATING
CERAMIC SUBSTRATE
FUSE ELEMENT
Cu / Ni PLATING
PACKAGING:  5,000 pcs./reel
3.1 ± 0.1
(.122 ± .004)
0.5 ± 0.3
(.020 ± .012)
0.5 ± 0.3
(.020 ± .012)
1.55 ± 0.1
(.061 ± .004)
0.5 ± 0.2
(.020 ± .008)
0.5 ± 0.2
(.020 ± .008)
0.6 ± 0.1
(.024 ± .004)
2.03
(.080)
3.81
(.150)
1.27
(.050)
SinglFuse
 SF-1206F Series Applications
Operating Temperature ..................................................................................-40 °C to +105 °C
Storage Conditions
     Temperature ................................................................................................+5 °C to +35 °C 
     Humidity...........................................................................................................40 % to 75 %
     Shelf Life........................................................................... 2 years from manufacturing date
Specifi cations are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specifi c applications.