Bourns PTC fuse Current I(H) 0.09 A 230 V (L x W x H) 11.5 x 11 x 9 mm CMF-SDP50-2 1 pc(s) CMF-SDP50-2 数据表
产品代码
CMF-SDP50-2
Solder Reflow Recommendations
160–220
300
250
200
150
100
50
0
10–20
Temperature (
°
C)
120
Preheating
Soldering
Cooling
Time (seconds)
Solder reflow
• Recommended reflow methods: IR, vapor phase oven, hot air oven.
• Devices are not designed to be wave soldered to the bottom side of the
• Devices are not designed to be wave soldered to the bottom side of the
board.
• Gluing the devices is not recommended.
• Recommended maximum paste thickness is 0.25 mm (.010 inch).
• Devices can be cleaned using standard industry methods and solvents.
Note:
• Recommended maximum paste thickness is 0.25 mm (.010 inch).
• Devices can be cleaned using standard industry methods and solvents.
Note:
• If reflow temperatures exceed the recommended profile, devices may not
meet the performance specifications.
Rework
• A device should not be reworked.
CMF-SDP SERIES, REV. C, 11/08
CMF-SDP Series - Telecom CPTC Resettable Fuses
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
Product Dimensions
Recommended Pad Layout
Recommended Pad Layout
Packaging options: TAPE & REEL: 350 pcs. per reel
Packaging options: TAPE & REEL: 400 pcs. per reel
MM
(INCHES)
DIMENSIONS =
8.75
(.344)
MAX.
MAX.
MAX.
7.2
(.283)
3.9
(.154)
0.5
(.020)
2 PLCS.
10.2
(402)
2.4
(.094)
CMF-SDP10A, 25A, 35A & 50A
5.0
(.197)
11.0
(.433)
MAX.
9.0
(.354)
MAX.
11.5
(.453)
MAX.
2.6
(.102)
CMF-SDP07, 10, 25, 35, 50 & 75
7.2
(.283)
MAX.
8.75
(.344)
MAX.
3.2
(.126)
2.0
(.079)
2.4
(.094)
6.3
(.248)
3.9
(.154)
8.2
(.323)
9.0
(.354)
10.0
(.394)
3.2
(.126)
2.0
(.079)
2.6
(.102)
7.6
(.299)
11.0
(.433)
5.0
(.197)