Intel 900 MHz KC80526NY900128 数据表
产品代码
KC80526NY900128
R
60
Mobile Intel® Celeron® Processor Specification Update
Specification Clarifications
The Specification Clarifications listed in this section apply to:
•
Mobile Intel
®
Celeron
®
Processor in BGA2 and Micro-PGA2 Packages at 900 MHz, 850 MHz, 800
MHz, 750 MHz, 700 MHz, 650 MHz, 600 MHz, 550 MHz, 500 MHz, 450 MHz, Low voltage 600
MHz, Low voltage 500 MHz, Low voltage 400A MHz, Ultra Low Voltage 600MHz and Ultra Low
Voltage 500 MHz datasheet (Order Number 283654-003)
MHz, Low voltage 500 MHz, Low voltage 400A MHz, Ultra Low Voltage 600MHz and Ultra Low
Voltage 500 MHz datasheet (Order Number 283654-003)
•
Mobile Intel
®
Celeron
®
Processor (0.18μ) in Micro-FCBGA and Micro-FCPGA packages at 933,
866, 800A, and 733 MHz (Order Number 298514-001)
•
Mobile Intel
®
Celeron
®
Processor (0.13μ) in Micro-FCBGA in Low Voltage Package at 650 MHz
(Order Number 298517-001)
•
Intel
®
Celeron
®
Processor Mobile Module: Mobile Module Connector 2 (MMC-2) at 700 MHz, 650
MHz, 600 MHz, 550 MHz, 500 MHz and 450 MHz datasheet
•
Intel® 64 and Intel IA-32 Architectures Software Developer’s Manual, Volumes 1, 2A, 2B, 3A, and
3B
3B
•
P6 Family of Processors Hardware Developer’s Manual
•
Intel
®
Celeron
®
Processor – Low Power/Ultra Low Power Datasheet (Order Number 273509-01)
All Specification Clarifications will be incorporated into a future version of the appropriate
documentation.
documentation.
M1. Temperature Specification Clarification for Measuring Currents
The Mobile Intel
® Celeron® Processor (0.18µ) in BGA2 and Micro-PGA2 Packages Datasheet (Order
Number 283654-002) has the following Specification Clarifications on note 3 of Table 32, Section 6.
The temperature at which the currents are measured was not clearly specified in note 3 of Table 32.
The temperature at which the currents are measured was not clearly specified in note 3 of Table 32.
Table 32. Mobile Celeron Processor Power Specifications
Symbol Parameter TDP
Typ
1,3
TDP Max
2,3
P
SGNT
3,4
P
QS
3,5
P
DSLP
3,6
Unit
Power
at 500 MHz & 1.10V
at 600 MHz & 1.10V
at 600 MHz & 1.15V
at 400A MHz & 1.35V
at 500 MHz & 1.35V
at 600 MHz & 1.35V
at 450 MHz & 1.60V
at 500 MHz & 1.60V
at 550 MHz & 1.60V
at 600 MHz & 1.60V
at 650 MHz & 1.60V
at 700 MHz & 1.60V
at 750 MHz & 1.60V
at 800 MHz & 1.60V
at 850 MHz & 1.60V
at 600 MHz & 1.10V
at 600 MHz & 1.15V
at 400A MHz & 1.35V
at 500 MHz & 1.35V
at 600 MHz & 1.35V
at 450 MHz & 1.60V
at 500 MHz & 1.60V
at 550 MHz & 1.60V
at 600 MHz & 1.60V
at 650 MHz & 1.60V
at 700 MHz & 1.60V
at 750 MHz & 1.60V
at 800 MHz & 1.60V
at 850 MHz & 1.60V
5.0
6.4
7.0
6.5
7.9
8.7
6.4
7.0
6.5
7.9
8.7
10.2
11.2
11.9
13.0
14.0
15.0
15.8
17.6
18.8
11.2
11.9
13.0
14.0
15.0
15.8
17.6
18.8
8.1
9.7
9.7
9.7
9.7
10.1
12.2
14.4
15.5
16.8
18.4
20.0
21.5
23.0
24.6
25.9
27.5
12.2
14.4
15.5
16.8
18.4
20.0
21.5
23.0
24.6
25.9
27.5
0.8
0.8
0.7
1.1
1.1
1.1
1.7
1.7
1.7
1.7
1.7
2.7
2.7
0.8
0.7
1.1
1.1
1.1
1.7
1.7
1.7
1.7
1.7
2.7
2.7
2.51
2.51
2.51
0.6
0.6
0.5
0.8
0.8
0.8
1.3
1.3
1.3
1.3
1.3
1.9
1.9
0.6
0.5
0.8
0.8
0.8
1.3
1.3
1.3
1.3
1.3
1.9
1.9
1.76
1.76
1.76
0.2
0.2
0.3
0.3
0.3
0.3
0.5
0.5
0.5
0.5
0.5
0.2
0.3
0.3
0.3
0.3
0.5
0.5
0.5
0.5
0.5
0.75
0.75
0.87
0.87
0.75
0.87
0.87
W
W
W
W
W
W
W
W
W
W
W
W
W
W
W
W
W
W
W
W
W
W
W
W
W
W
W
W
W
T
J
Junction Temperature is
measured with the on-die
thermal diode
measured with the on-die
thermal diode
100 100 50
50
35
°C
NOTE:
1.
TDPTYP is a recommendation based on the power dissipation of the processor while executing publicly
available software under normal operating conditions at nominal voltages. Not 100% tested.
available software under normal operating conditions at nominal voltages. Not 100% tested.
2.
TDPMAX is a specification of the total power dissipation of the processor while executing a worst-case
instruction mix under normal operating conditions at nominal voltages. It includes the power dissipated by all of
the components within the processor. Not 100% tested. Specified by design/characterization.
instruction mix under normal operating conditions at nominal voltages. It includes the power dissipated by all of
the components within the processor. Not 100% tested. Specified by design/characterization.
3.
Not 100% tested. These power specifications are determined by characterization of the processor currents at
higher temperatures and extrapolating the values for the temperature indicated.
higher temperatures and extrapolating the values for the temperature indicated.
4.
PSGNT is Stop Grant and Auto Halt power.
5.
PQS is Quick Start and Sleep power.