Intel III Xeon 933 MHz 80526KB933256 数据表
产品代码
80526KB933256
PENTIUM® III XEON™ PROCESSOR AT 600 MHz to 1 GHz with 256KB L2 Cache
THERMAL SPECIFICATIONS
54
Table 42 Power Dissipation
1
Frequency
Core
Power
2
(W)
2.8V
OCVR
Power (W)
5/12V
OCVR
Power (W)
2.8V
Cartridge
Power
3
(W)
5/12V
Cartridge
Power
3
(W)
2.8V
Thermal
Power
4 ,7
(W)
5/12V
Thermal
Power
4 ,7
(W)
AGTL+
Power
5
Min
Tplate
°°C
Max
Tplate
°°C
600 MHz
16.9
3.9
4.8
20.8
21.6
18.8
19.2
2
0
55
667 MHz
18.6
4.4
5.3
23.0
23.9
20.8
21.3
2
0
55
733 MHz
20.4
4.8
5.8
25.2
26.2
22.8
23.3
2
0
55
800 MHz
22.2
5.2
6.3
27.4
28.5
24.8
25.4
2
0
55
866 MHz
24.0
5.6
6.8
29.6
30.8
26.8
27.4
2
0
55
933 MHz
25.9
6.1
7.3
32.0
33.2
28.9
29.6
2
0
55
1 GHz
27.0
6.3
7.6
33.3
34.6
30.2
30.8
2
0
55
FMB
6
-
-
-
-
-
37.0
37.0
-
0
55
NOTES:
1.
These values are specified at nominal
VCC_CORE
for the processor core with integrated L2 cache.
2.
Core power indicates the combined worst-case power that can be dissipated by the processor & L2 cache. This value
will be determined after the product has been characterized.
will be determined after the product has been characterized.
3.
Cartridge power indicates the worst-case power that can be dissipated by the processor, L2 cache and the OCVR. It is
not possible for the AGTL+ bus, and the processor core to all be at full power simultaneously.
not possible for the AGTL+ bus, and the processor core to all be at full power simultaneously.
4.
Thermal power (which should be used for thermal designs) indicates the worst-case power that can be dissipated by
the processor, L2 cache and 50% of the OCVR (since the OCVR does not contact the Thermal Plate). De-rating the
thermal design power may result in exceeding the Tplate maximum temperature specification, which may result
in immediate system failure or degradation of the processor’s functional lifetime. AGTL+ power is the worst-
case power dissipated in the termination resistors for the AGTL+ bus.
the processor, L2 cache and 50% of the OCVR (since the OCVR does not contact the Thermal Plate). De-rating the
thermal design power may result in exceeding the Tplate maximum temperature specification, which may result
in immediate system failure or degradation of the processor’s functional lifetime. AGTL+ power is the worst-
case power dissipated in the termination resistors for the AGTL+ bus.
5.
"FMB" is a suggested design guideline for a flexible motherboard design.
6.
A disabled Pentium III Xeon processor at 600 MHz+ OCVR draws approximately 46 mA load at 2.8V VCC
_
CORE
from the
motherboard VRM. If your system needs to maintain VRM regulation with a disabled Pentium III Xeon processor at 600
MHz+ (OCVR_EN inactive), the VRM output minimum load specification should be 46 mA or less.
MHz+ (OCVR_EN inactive), the VRM output minimum load specification should be 46 mA or less.
7.
The Thermal Power specifications have been recently redefined. These values are based
on device characterization
and do not reflect any silicon design changes to lower processor power consumption. Absolute power consumption has
not changed; however, the maximum thermal power specifications are being updated to reflect actual silicon
performance. The Thermal Power values represent the thermal design point required to cool the Pentium III Xeon
processor at 600 MHz+
not changed; however, the maximum thermal power specifications are being updated to reflect actual silicon
performance. The Thermal Power values represent the thermal design point required to cool the Pentium III Xeon
processor at 600 MHz+
in the platform environment .