Intel ULV 733/733J LE80536UC0052M 数据表
产品代码
LE80536UC0052M
Intel
®
Pentium
®
M Processor Datasheet
39
Package Mechanical Specifications and Pin Information
4
Package Mechanical
Specifications and Pin Information
Specifications and Pin Information
The Intel Pentium M processor is available in 478-pin, Micro-FCPGA and 479-ball, Micro-
FCBGA packages. The Low Voltage and Ultra Low Voltage Intel Pentium M processors are
available only in the Micro-FCBGA package. Different views of the Micro-FCPGA package are
shown in
FCBGA packages. The Low Voltage and Ultra Low Voltage Intel Pentium M processors are
available only in the Micro-FCBGA package. Different views of the Micro-FCPGA package are
shown in
through
. Different views of
through
. Package dimensions are
shown in
. The Intel Pentium M Processor Die Offset is illustrated in
The Micro-FCBGA may have capacitors placed in the area surrounding the die. Because the die-
side capacitors are electrically conductive, and only slightly shorter than the die height, care should
be taken to avoid contacting the capacitors with electrically conductive materials. Doing so may
short the capacitors, and possibly damage the device or render it inactive. The use of an insulating
material between the capacitors and any thermal solution is recommended to prevent capacitor
shorting.
side capacitors are electrically conductive, and only slightly shorter than the die height, care should
be taken to avoid contacting the capacitors with electrically conductive materials. Doing so may
short the capacitors, and possibly damage the device or render it inactive. The use of an insulating
material between the capacitors and any thermal solution is recommended to prevent capacitor
shorting.
Figure 4. Micro-FCPGA Package Top and Bottom Isometric Views
NOTE: All dimensions in millimeters. Values shown for reference only. Refer to
for details.
TOP VIEW
BOTTOM VIEW
LABEL
PACKAGE KEEPOUT
DIE
CAPACITOR AREA