Samsung 128Mb, ECC PC800 Rambus RDRAM MR18R1624EG0-CM8 产品宣传页
产品代码
MR18R1624EG0-CM8
Page 13
MR16R1624(8/G)EG0
MR18R1624(8/G)EG0
MR18R1624(8/G)EG0
Version 1.0 May 2004
Physical Dimensions -4 ( For Heat Spreader )
The following defines the RIMM module dimensions. All units are in millimeters with inches in brackets[ ], where appropriate.
The dimensions without tolerance specification use the default tolerance of
The dimensions without tolerance specification use the default tolerance of
±0.127[±0.005].
108.81
±
0.12[4.283
±
0.005]
DIA 2.36
±
0.05[0.09
±
0.001]
12.7
±
0.07[0.5
±
0.002]
12.7
±
0.07[0.5
±
0.002]
WARNING ! HOT SURFACE
http://www.samsungsemi.com
2.9
1.00
±
0.07
[0.04
±
0.002]
WARNING ! HOT SURFACE
http://www.samsungsemi.com
133.35
±
0.127[5.250
±
0.005]
127
±
0.25[5.0
±
0.009]
29.4
2
[1.
158]
158]
2
9
.42
[1.1
58]
58]
Center-Point
[0.114]
34.9
3
[1.
375]
375]
16
.5[0
.5[0
.649
]
A
A
120.66
±
0.12[4.748
±
0.005]
127
±
0.25[5.0
±
0.009]
Material
CSP
1.27
±
0.10
[0.050
±
0.004]
Thermal
Conductive
Gap Filling
Conductive
Gap Filling
Max 7.80
[0.307]
PCB
Heat Spreader
[ Double side module ]
SECTION A-A
Material
CSP
1.27
±
0.10
[0.050
±
0.004]
Thermal
Conductive
Gap Filling
Conductive
Gap Filling
Max 4.70
[0.185]
PCB
Heat Spreader
[ Single side module ]
SECTION A-A
Figure 6: Heat Spreader Physical Dimensions