Cooler Master ThermalFusion 400 RG-TF4-TGU1-GP 产品宣传页
产品代码
RG-TF4-TGU1-GP
2008
ThermalFusion
400
ThermalFusion
400
ThermalFusion
400
ThermalFusion 400
is a supreme
thermal compound that includes high
thermal conductivity with low thermal
resistance. Its non-curing and non-
electrical conductive traits can avoid any
short circuit incidence. ThermalFusion
400 is the ultimate solution for thermal
dissipation to improve CPU, GPU cooling
and other bonding applications.
thermal conductivity with low thermal
resistance. Its non-curing and non-
electrical conductive traits can avoid any
short circuit incidence. ThermalFusion
400 is the ultimate solution for thermal
dissipation to improve CPU, GPU cooling
and other bonding applications.
Packaging Information
RG-TF4-TGU1-GP
Specifications
Gray
3.5
2.89
2.0E+10
0.032
0.008
<0.1
Color
Specific Gravity (25
℃)
Thermal Conductivity (W/m-K)
Thermal Resistance (
-cm²/W)
℃
Bond Line Thickness (mm)
Volatile Content (%)
Volume Resistivity (ohm-cm)
4
Net Weight (g)
Features
High Thermal Conductivity
Low Thermal Resistance
Non-Curing
Non-Corrosive
Non-Electrical Conductive
Low Thermal Resistance
Non-Curing
Non-Corrosive
Non-Electrical Conductive
EAN Code
4719512013182
UPC Code
Carton Size
Carton Size
Units / Carton
485 x 400 x 405 mm
200
Cuft
2.77
884102002687