Corsair DDR2 XMS2-6400 4GB DIMM TW2X4096-6400C5 产品宣传页
产品代码
TW2X4096-6400C5
www.corsair.com
The Twin2X2048-6400C5DHX is a 2048MByte matched pair of DDR2 SDRAM DIMMs built using Corsair’s latest high
performance heat sink with Dual-Path Heat Xchange (DHX) technology. This part delivers outstanding performance
in the latest generation of dual-channel DDR2-based motherboards. It has been tested extensively in multiple DDR2
motherboards to ensure compatibility and performance at its rated speed. This memory has been verified to operate
at 800MHz at the low latencies of 5-5-5-18.
performance heat sink with Dual-Path Heat Xchange (DHX) technology. This part delivers outstanding performance
in the latest generation of dual-channel DDR2-based motherboards. It has been tested extensively in multiple DDR2
motherboards to ensure compatibility and performance at its rated speed. This memory has been verified to operate
at 800MHz at the low latencies of 5-5-5-18.
T WIN2X2048-6400C5DHX
Every part is tested in Corsair's factory at 800MHz, but your actual results may vary depending on the overclocking margin of your CPU and motherboard. Newer
motherboards may be used for production test as they become available. Corsair may periodically update the part with newer RAM revisions of same or greater performance.
RAM used on the module may change without notice. © May 2007 Corsair Memory, Inc.
FEATURES
2048 Megabytes of DDR2 memory
Two matched CM2X1024-6400C5DHX modules
Unique DHX technology providing maximum cooling
100% tested at 800MHz in high performance DDR2
motherboards
motherboards
Lifetime warranty
TEST SPECS
Each module pair is tested together at 800MHz
Tested and packaged in pairs
Packaged together immediately following system
test
Tested at JEDEC standard latency settings (5-5-5-18) at
1.8V
1.8V
SPD programmed at:
JEDEC standard 5-5-5-18 values at 800MHz
Dual-Path Heat Xchange Diagram
• Optimized fins to maximize ambient airflow through the module array
• Extruded aluminum heat sinks to maximize convective heat dissipation
• Dedicated PCB heat sink
• Optimized fins to maximize ambient airflow through the module array
• Extruded aluminum heat sinks to maximize convective heat dissipation
• Dedicated PCB heat sink