Kingston Technology Memory HyperX 512GB 400Mhz DDR 2pk KHX3200ULK2/512 数据表
产品代码
KHX3200ULK2/512
Memory Module Specification
Document No. 4804029-001.A00
08/19/04
KHX3200ULK2/512
512MB (256MB 32M x 64-Bit x 2 pcs.)
PC3200 CL2 184-Pin DIMM Kit
KEYED
Page 1
DESCRIPTION:
Kingston's KHX3200ULK2/512 is a kit of two 32M x 64-bit (256MB) DDR400 SDRAM (Synchro-
nous DRAM) CL2 memory modules, based on eight 32M x 8-bit DDR TSOP components (per
module). Total kit capacity is 512MB. Each pair has been tested to run at DDR 400MHz at low latency
timing of 2-2-2-5 at 2.7V. Each 184-pin DIMM uses gold contact fingers and requires +2.6V. The
electrical and mechanical specifications are as follows:
nous DRAM) CL2 memory modules, based on eight 32M x 8-bit DDR TSOP components (per
module). Total kit capacity is 512MB. Each pair has been tested to run at DDR 400MHz at low latency
timing of 2-2-2-5 at 2.7V. Each 184-pin DIMM uses gold contact fingers and requires +2.6V. The
electrical and mechanical specifications are as follows:
FEATURES:
Power supply : Vdd: 2.6V ± 0.2V, Vddq: 2.6V ± 0.2V
Double-data-rate architecture; two data transfers per clock cycle
Bidirectional data strobe(DQS)
Differential clock inputs(CK and CK)
DLL aligns DQ and DQS transition with CK transition
Programmable Read latency 2 (clock)
Programmable Burst length (2, 4, 8)
Programmable Burst type (sequential & interleave)
Timing Reference: 2-2-2-5-1 at +2.7V
Edge aligned data output, center aligned data input
Auto & Self refresh, 7.8us refresh interval(8K/64ms refresh)
Serial presence detect with EEPROM
High Performance Heat Spreader
PCB : Height 1.250” (34.75mm), double sided component
Double-data-rate architecture; two data transfers per clock cycle
Bidirectional data strobe(DQS)
Differential clock inputs(CK and CK)
DLL aligns DQ and DQS transition with CK transition
Programmable Read latency 2 (clock)
Programmable Burst length (2, 4, 8)
Programmable Burst type (sequential & interleave)
Timing Reference: 2-2-2-5-1 at +2.7V
Edge aligned data output, center aligned data input
Auto & Self refresh, 7.8us refresh interval(8K/64ms refresh)
Serial presence detect with EEPROM
High Performance Heat Spreader
PCB : Height 1.250” (34.75mm), double sided component
PERFORMANCE:
Clock Cycle Time (tCK)
5ns (min.) / 10ns (max.)
Row Cycle Time (tRC)
55ns (min.)
Refresh Row Cycle Time (tRFC) 65ns (min.)
Row Active Time (tRAS)
Row Active Time (tRAS)
40ns (min.) / 100,000ns (max.)
Power
2.268 W (operating per module)
UL Rating
94 V - 0
Operating Temperature
0
o
C to 70
o
C
Storage Temperature
-55
o
C to +150
o
C
T E C H N O L O G Y