DELL CRT Television 产品宣传页
Product End of Life Instructions
Page 2
Plastic containing
Brominated flame
retardants other than in
PCB / PCA
This product may contain plastic parts greater than 25 grams. Many of these
parts are bromine free. Regardless, these parts are labeled (usually molded
directly into the plastic) per ISO 11469:2000(E).
A typical label would look like:
> Polymer Abbreviation - FR(#) <
i.e. > PC + ABS FR(40) <
Flame retardant codes (FR(#)) are given in ISO 1043-4. Codes for some
Brominated flame retardants:
14 aliphatic/alicyclic Brominated compounds
15 aliphatic/alicyclic Brominated compounds in combination with antimony
compounds
16 aromatic Brominated compounds (excluding Brominated diphenyl ether
and biphenyls)
17 aromatic Brominated compounds (excluding Brominated diphenyl ether
and biphenyls) in combination with antimony compounds
22 aliphatic/alicyclic chlorinated and Brominated compounds
42 Brominated organic phosphorus compounds
parts are bromine free. Regardless, these parts are labeled (usually molded
directly into the plastic) per ISO 11469:2000(E).
A typical label would look like:
> Polymer Abbreviation - FR(#) <
i.e. > PC + ABS FR(40) <
Flame retardant codes (FR(#)) are given in ISO 1043-4. Codes for some
Brominated flame retardants:
14 aliphatic/alicyclic Brominated compounds
15 aliphatic/alicyclic Brominated compounds in combination with antimony
compounds
16 aromatic Brominated compounds (excluding Brominated diphenyl ether
and biphenyls)
17 aromatic Brominated compounds (excluding Brominated diphenyl ether
and biphenyls) in combination with antimony compounds
22 aliphatic/alicyclic chlorinated and Brominated compounds
42 Brominated organic phosphorus compounds
Capacitors with PCB’s
Dell does not use capacitors with PCB.
Electrolyte capacitors
(height > 25mm, diameter
> 25mm)
Electrolytic capacitors (height and/or diameter greater than 25mm) may be
present in the power supply of this product.
present in the power supply of this product.
Asbestos and its
compounds
Parts used in Dell products cannot contain asbestos or its compounds.
Refractory ceramic fibres
Parts used in Dell products cannot contain refractory ceramic fibers.
Radio-active substances
Parts used in Dell products cannot contain Radio-active substances.
Beryllium and its
compounds (including
Beryllium Oxide)
Beryllium may be present in electronic components as a copper beryllium
alloy, which contains less than 2% beryllium. CuBe alloys may be used in
various components such as connectors, switches, relays, current carrying
springs, integrated circuit sockets, and RF shielding.
alloy, which contains less than 2% beryllium. CuBe alloys may be used in
various components such as connectors, switches, relays, current carrying
springs, integrated circuit sockets, and RF shielding.
Gasses - which fall under
Regulation (EC)
2037/2000 and all
hydrocarbons (HC)
Parts used in Dell products do not contain gasses which fall under Regulation
(EC 2037/2000) and all hydrocarbons (HC).
(EC 2037/2000) and all hydrocarbons (HC).
Components with
pressurized gas which
need special attention
(Pressure > 1,5bar)
Product does not contain parts with pressurized gas.
Liquids
Product does not contain liquid.
DELL CORPORATE ENVIRONMENTAL INFORMATION
Information on Dell’s Environmental initiatives, policies, programs and goals can be found at