Intel DP55WG BOXDP55WG 用户手册

产品代码

BOXDP55WG

EMc regulations (tested in representative chassis)

united States

FCC 47 CFR Part 15, Subpart B
canada

ICES-003 Class B
Europe

(EMC Directive 2004/108/EC)

EN 55022:2006 and EN 55024:1998
Australia/New Zealand

EN 55022:2006 Class B
Japan

VCCI V-3/04.04, V-4/03.04, Class B
South Korea

KN-22:2005 and KN-24:2005
Taiwan

CNS 13438:2006 Class B
International

CISPR 22:2005 +A1:2005 +A2:2006 Class B
Environmental compliance
Europe

Europe RoHS (Directive 2002/95/EC)
china

China RoHS (MII Order # 39)

Lead-free: The symbol is used to identify

electrical and electronic assemblies and com-

ponents in which the lead (Pb) concentration

level in any of the raw materials and the end product

is not greater than 0.1% by weight (1000 ppm). This

symbol is also used to indicate conformance to lead-

free requirements and definitions adopted under

the European Union’s Restriction on Hazardous

Substances (RoHS) directive, 2002/95/EC.

For ordering information, visit

www.intel.com

For the most current product information,
visit www.intel.com/go/idb
or http://ark.intel.com

For specific CPU compatibility, visit

http://processormatch.intel.com

procESSor

processor Support

• Intel® Core™ i7 and Intel® Core™ i5 processors in the

LGA1156 package

• Intel® Turbo Boost Technology

• Intel® Hyper-Threading Technology

• Integrated Memory Controller with support for up

to 16 GB

of system memory DDR3 1600+

/ 1333 /

1066 MHz SDRAM

• Intel® Fast Memory Access

• Supports Intel® 64 architecture

cHIpSET

New Intel® p55 Express chipset

• Intel® 82P55 Platform Controller Hub (PCH)

• Intel® Matrix Storage Technology (RAID 0, 1, 5, 10)
Intel® platform controller Hub

• Six onboard SATA ports

uSB 2.0

Integrated Intel® pcH controllers

• Eight Hi-Speed USB 2.0 ports

• Six additional ports via two internal headers
System BIoS

• 16 Mb Flash EEPROM with Intel® Platform Innovation

Framework for EFI Plug and Play, IDE drive auto-

configure

• Advanced configuration and power interface

V3.0b, DMI 2.5
Intel® rapid BIoS Boot

• Intel® Rapid BIOS Boot

• Intel® Express BIOS update support: BIOS update

via new F7 function key

DDR3 1600 or higher memory support requires compatible Intel® XMP-enabled memory or advanced knowledge of BIOS and memory tuning; individual results may vary. Altering PC memory frequency and/or

voltage may (i) reduce system stability and use life of the system, memory and processor; (ii) cause the processor and other system components to fail; (iii) cause reductions in system performance; (iv)

cause additional heat or other damage; and (v) affect system data integrity. Intel assumes no responsibility that the memory, included if used with altered clock frequencies and/or voltages, will be fit for

any particular purpose. Check with memory manufacturer for warranty and additional details. For specific supported memory for this motherboard, please visit www.intel.com/go/idb for more details.

Intel® Turbo Boost Technology requires a PC with a processor with Intel Turbo Boost Technology capability. Intel Turbo Boost Technology performance varies depending on hardware, software, and overall

system configuration. Check with your PC manufacturer on whether your system delivers Intel Turbo Boost Technology. See www.intel.com/technology/turboboost for more information.

Intel® Hyper-Threading Technology requires a computer system with a processor supporting HT Technology and an HT Technology-enabled chipset, BIOS, and operating system. Performance will vary

depending on the specific hardware and software you use. For more information including details on which processors support HT Technology, see www.intel.com/info/hyperthreading.

System resources and hardware (such as PCI and PCI Express*) require physical memory address locations that can reduce available addressable system memory. This could result in a reduction of as much

as 1 GB or more of physical addressable memory being available to the operating system and applications, depending on the system configuration and operating system.

Intel® High Definition Audio requires a system with an appropriate Intel® chipset and a motherboard with an appropriate codec and the necessary drivers installed. System sound quality will vary depending

on actual implementation, controller, codec, drivers, and speakers. For more information about Intel® HD Audio, refer to www.intel.com/design/chipsets/hdaudio.htm

64-bit computing on Intel® architecture requires a computer system with a processor, chipset, BIOS, operating system, device drivers, and applications enabled for Intel® 64 architecture. Processors will not

operate (including 32-bit operation) without an Intel 64 architecture-enabled BIOS. Performance will vary depending on your hardware and software configurations. See http://developer.intel.com/technology/

intel64/index.htm for more information.

INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS

GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL’S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS

OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR

INFRINGEMENT OF ANY PATENT, COPYRIGHT, OR OTHER INTELLECTUAL PROPERTY RIGHT.

Intel products are not intended for use in medical, life-saving, or life-sustaining applications. Intel may make changes to specifications and product descriptions at any time, without notice.

All products, dates, and figures specified are preliminary based on current expectations, and are subject to change without notice. Availability in different channels may vary.

Actual Intel® Desktop Board may differ from the image shown.

Intel, the Intel logo, Intel Core, and Core Inside are trademarks of Intel Corporation in the U.S. and other countries.

* Other names and brands may be claimed as the property of others.

Intel® Desktop Board DP55WG Media Series

Technical Specifications

Hardware Management features

• Processor fan speed control

• System chassis fan speed control

• Voltage and temperature sensing

• Fan sensor inputs used to monitor fan activity

• Power management support for ACPI 3.0b
Intel® pro 10/100/1000 Network connection

• New low-power design can meet Energy Star* 5.0

specifications
Expansion capabilities

• One PCI Express* 2.0 x16 slot, switchable to two

PCI Express 2.0 x8 slots

• Two PCI Express 2.0 x1 slots
Audio

• 10-channel Intel® High Definition Audio

codec

• 8-channel via the back panel

• 2-channel via the front panel

• Back panel support for both input and output

via optical cable

• One internal header for S/PDIF output for HDMI*

support

SySTEM MEMory

Memory capacity

• Four 240-pin DIMM connectors supporting up to

two double-sided DIMMs

• Maximum system memory up to 16 GB

using 4 GB

double-sided DIMMs
Memory Types

• DDR3 1600 / 1333 / 1066 / 800 SDRAM memory

support

• Non-ECC Memory

Memory Modes

• Dual- or single-channel operation support
Memory Voltage

• 1.35 V low voltage

• 1.5 V standard JEDEC voltage

• Support for Intel® XMP extended voltage profiles

JuMpErS AND froNT-pANEL coNNEcTorS

Jumpers

• Single configuration jumper design

• Jumper access for BIOS maintenance mode
front-panel connectors

• Reset, HD LED, Power LEDs, power on/off

• Two front-panel Hi-Speed USB 2.0 headers

• Front-panel audio header

• One IEEE 1394a header

MEcHANIcAL

Board Style

• ATX
Board Size

• 9.6” x 12” (24.38 cm x 30.48 cm)
Baseboard power requirements

• ATX 12 V

ENVIroNMENT

operating Temperature

• 0° C to +55° C
Storage Temperature

• -20° C to +70° C

rEGuLATIoNS AND SAfETy STANDArDS

united States and canada

CSA/UL 60950-1, First Edition (Binational Standard)
Europe

(Low Voltage Directive 2006/95/EC)

EN 60950-1:2006
International

IEC 60950-1:2001, First Edition