Intel E5520 AT80602002091AA 用户手册
产品代码
AT80602002091AA
Boxed Processor Specifications
140
Intel
®
Xeon
®
Processor 5500 Series Datasheet, Volume 1
8.2
Mechanical Specifications
This section documents the mechanical specifications of the boxed processor solution.
8.2.1
Boxed Processor Heat Sink Dimensions and Baseboard
Keepout Zones
The boxed processor and boxed thermal solution will be sold separately. Clearance is
required around the thermal solution to ensure unimpeded airflow for proper cooling.
Baseboard keepout zones are shown in
required around the thermal solution to ensure unimpeded airflow for proper cooling.
Baseboard keepout zones are shown in
through
. Physical space
requirements and dimensions for the boxed processor and assembled heat sink are
shown in
shown in
. Mechanical drawings for the 4-pin fan header and 4-pin connector
used for the active fan heat sink solution are represented in
and
None of the heat sink solutions exceed a mass of 550 grams. Note that this is per
processor, a dual processor system will have up to 1100 grams total mass in the heat
sinks.
processor, a dual processor system will have up to 1100 grams total mass in the heat
sinks.
See