Intel L5506 AT80602002712AA 用户手册
产品代码
AT80602002712AA
Intel
®
Xeon
®
Processor 5500 Series Datasheet, Volume 1
89
Thermal Specifications
6
Thermal Specifications
6.1
Package Thermal Specifications
The Intel
®
Xeon
®
processor 5500 series requires a thermal solution to maintain
temperatures within operating limits. Any attempt to operate the processor outside
these limits may result in permanent damage to the processor and potentially other
components within the system. Maintaining the proper thermal environment is key to
reliable, long-term system operation.
these limits may result in permanent damage to the processor and potentially other
components within the system. Maintaining the proper thermal environment is key to
reliable, long-term system operation.
A complete solution includes both component and system level thermal management
features. Component level thermal solutions can include active or passive heatsinks
attached to the processor integrated heat spreader (IHS). Typical system level thermal
solutions may consist of system fans combined with ducting and venting.
features. Component level thermal solutions can include active or passive heatsinks
attached to the processor integrated heat spreader (IHS). Typical system level thermal
solutions may consist of system fans combined with ducting and venting.
This section provides data necessary for developing a complete thermal solution. For
more information on designing a component level thermal solution, refer to the Intel®
Xeon® Processor 5500 Series Thermal / Mechanical Design Guide (TMDG).
more information on designing a component level thermal solution, refer to the Intel®
Xeon® Processor 5500 Series Thermal / Mechanical Design Guide (TMDG).
Note:
The boxed processor will ship with a component thermal solution. Refer to
for
details on the boxed processor.
6.1.1
Thermal Specifications
To allow optimal operation and long-term reliability of Intel processor-based systems,
the processor must remain within the minimum and maximum case temperature
(T
the processor must remain within the minimum and maximum case temperature
(T
CASE
) specifications as defined by the applicable thermal profile. See
and
for Intel
®
Xeon
®
Processor W5580 (130W TDP);
and
for Intel Xeon processor 5500 series Standard/Basic SKUs
(80W TDP);
for Intel Xeon processor 5500 series Low Power
SKU (60W TDP);
for Intel
®
Xeon
®
Processor L5518 (60W
for Intel
®
Xeon
®
Processor
L5508 (38W TDP) supporting NEBS thermals. Thermal solutions not designed to
provide this level of thermal capability may affect the long-term reliability of the
processor and system. For more details on thermal solution design, please refer to this
processor’s TMDG.
provide this level of thermal capability may affect the long-term reliability of the
processor and system. For more details on thermal solution design, please refer to this
processor’s TMDG.
The Intel Xeon processor 5500 series implement a methodology for managing
processor temperatures which is intended to support acoustic noise reduction through
fan speed control and to assure processor reliability. Selection of the appropriate fan
speed is based on the relative temperature data reported by the processor’s Platform
Environment Control Interface (PECI) as described in
processor temperatures which is intended to support acoustic noise reduction through
fan speed control and to assure processor reliability. Selection of the appropriate fan
speed is based on the relative temperature data reported by the processor’s Platform
Environment Control Interface (PECI) as described in
. If PECI is less than
TCONTROL, then the case temperature is permitted to exceed the Thermal Profile, but
PECI must remain at or below TCONTROL. If PECI >= TCONTROL, then the case
temperature must meet the Thermal Profile. The temperature reported over PECI is
always a negative value and represents a delta below the onset of thermal control
circuit (TCC) activation, as indicated by PROCHOT# (see
PECI must remain at or below TCONTROL. If PECI >= TCONTROL, then the case
temperature must meet the Thermal Profile. The temperature reported over PECI is
always a negative value and represents a delta below the onset of thermal control
circuit (TCC) activation, as indicated by PROCHOT# (see
Thermal Features). Systems that implement fan speed control must be designed to use
this data. Systems that do not alter the fan speed only need to guarantee the case
temperature meets the thermal profile specifications.
this data. Systems that do not alter the fan speed only need to guarantee the case
temperature meets the thermal profile specifications.