Renesas M306H2T-RPD-E 用户手册
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Chapter 2. Preparation
This chapter describes the package components, the system configuration and the preparation for using this product for the
first time.
first time.
2.1 Terminology ............................................................................................................................... 22
2.2 Package Components .................................................................................................................. 23
2.3 Other Tool Products Required for Development ........................................................................ 23
2.4 Name of Each Part ...................................................................................................................... 24
(1) System Configuration ........................................................................................................... 24
(2) Inside of the Emulation Pod .................................................................................................. 25
2.5 When Using the Emulator for the First Time ............................................................................. 26