Cypress CY7C1427AV18 用户手册
36-Mbit DDR-II SRAM 2-Word
Burst Architecture
CY7C1416AV18, CY7C1427AV18
CY7C1418AV18, CY7C1420AV18
CY7C1418AV18, CY7C1420AV18
Cypress Semiconductor Corporation
•
198 Champion Court
•
San Jose
,
CA 95134-1709
•
408-943-2600
Document Number: 38-05616 Rev. *F
Revised January 29, 2009
Features
■
36-Mbit density (4M x 8, 4M x 9, 2M x 18, 1M x 36)
■
300 MHz clock for high bandwidth
■
2-word burst for reducing address bus frequency
■
Double Data Rate (DDR) interfaces
(data transferred at 600MHz) at 300 MHz for DDR-II
(data transferred at 600MHz) at 300 MHz for DDR-II
■
Two input clocks (K and K) for precise DDR timing
❐
SRAM uses rising edges only
■
Two input clocks for output data (C and C) to minimize clock
skew and flight time mismatches
skew and flight time mismatches
■
Echo clocks (CQ and CQ) simplify data capture in high-speed
systems
systems
■
Synchronous internally self-timed writes
■
1.8V core power supply with HSTL inputs and outputs
■
Variable drive HSTL output buffers
■
Expanded HSTL output voltage (1.4V–V
DD
)
■
Available in 165-Ball FBGA package (15 x 17 x 1.4 mm)
■
Offered in both in Pb-free and non Pb-free packages
■
JTAG 1149.1 compatible test access port
■
Delay Lock Loop (DLL) for accurate data placement
Configurations
CY7C1416AV18 – 4M x 8
CY7C1427AV18 – 4M x 9
CY7C1418AV18 – 2M x 18
CY7C1420AV18 – 1M x 36
Functional Description
The CY7C1416AV18, CY7C1427AV18, CY7C1418AV18, and
CY7C1420AV18 are 1.8V Synchronous Pipelined SRAM
equipped with DDR-II architecture. The DDR-II consists of an
SRAM core with advanced synchronous peripheral circuitry and
a 1-bit burst counter. Addresses for read and write are latched
on alternate rising edges of the input (K) clock. Write data is
registered on the rising edges of both K and K. Read data is
driven on the rising edges of C and C if provided, or on the rising
edge of K and K if C/C are not provided. Each address location
is associated with two 8-bit words in the case of CY7C1416AV18
and two 9-bit words in the case of CY7C1427AV18 that burst
sequentially into or out of the device. The burst counter always
starts with a “0” internally in the case of CY7C1416AV18 and
CY7C1427AV18. On CY7C1418AV18 and CY7C1420AV18, the
burst counter takes in the least significant bit of the external
address and bursts two 18-bit words in the case of
CY7C1418AV18 and two 36-bit words in the case of
CY7C1420AV18 sequentially into or out of the device.
CY7C1420AV18 are 1.8V Synchronous Pipelined SRAM
equipped with DDR-II architecture. The DDR-II consists of an
SRAM core with advanced synchronous peripheral circuitry and
a 1-bit burst counter. Addresses for read and write are latched
on alternate rising edges of the input (K) clock. Write data is
registered on the rising edges of both K and K. Read data is
driven on the rising edges of C and C if provided, or on the rising
edge of K and K if C/C are not provided. Each address location
is associated with two 8-bit words in the case of CY7C1416AV18
and two 9-bit words in the case of CY7C1427AV18 that burst
sequentially into or out of the device. The burst counter always
starts with a “0” internally in the case of CY7C1416AV18 and
CY7C1427AV18. On CY7C1418AV18 and CY7C1420AV18, the
burst counter takes in the least significant bit of the external
address and bursts two 18-bit words in the case of
CY7C1418AV18 and two 36-bit words in the case of
CY7C1420AV18 sequentially into or out of the device.
Asynchronous inputs include an output impedance matching
input (ZQ). Synchronous data outputs (Q, sharing the same
physical pins as the data inputs D) are tightly matched to the two
output echo clocks CQ/CQ, eliminating the need for separately
capturing data from each individual DDR SRAM in the system
design. Output data clocks (C/C) enable maximum system
clocking and data synchronization flexibility.
input (ZQ). Synchronous data outputs (Q, sharing the same
physical pins as the data inputs D) are tightly matched to the two
output echo clocks CQ/CQ, eliminating the need for separately
capturing data from each individual DDR SRAM in the system
design. Output data clocks (C/C) enable maximum system
clocking and data synchronization flexibility.
All synchronous inputs pass through input registers controlled by
the K or K input clocks. All data outputs pass through output
registers controlled by the C or C (or K or K in a single clock
domain) input clocks. Writes are conducted with on-chip
synchronous self-timed write circuitry.
the K or K input clocks. All data outputs pass through output
registers controlled by the C or C (or K or K in a single clock
domain) input clocks. Writes are conducted with on-chip
synchronous self-timed write circuitry.
Selection Guide
Description
300 MHz
278 MHz
250 MHz
200 MHz
167 MHz
Unit
Maximum Operating Frequency
300
278
250
200
167
MHz
Maximum Operating Current
x8
845
795
725
600
500
mA
x9
850
800
725
600
500
x18
900
835
760
620
525
x36
990
910
825
675
570