用户手册目录Introduction71.1. Scope71.2. Audience71.3. Contact Information, Support71.4. Document Organization81.5. Text Conventions91.6. Related Documents92. Overview103. GE865 Mechanical Dimensions114. GE865 module connections124.1. PIN-OUT124.1.1. BGA Balls Layout155. Hardware Commands165.1. Turning ON the GE865165.3. Resetting the GE865225.3.1. Hardware Unconditional restart226. Power Supply256.1. Power Supply Requirements256.2. Power Consumption266.2.1. Power consumption Plots276.3. General Design Rules316.3.1. Electrical Design Guidelines316.3.1.1. + 5V input Source Power Supply Design Guidelines316.3.1.2. + 12V input Source Power Supply Design Guidelines326.3.1.3. Battery Source Power Supply Design Guidelines336.3.2. Thermal Design Guidelines346.3.3. Power Supply PCB layout Guidelines357. Antenna367.1. GSM Antenna Requirements367.2. GSM Antenna - PCB line Guidelines377.3. PCB Guidelines in case of FCC certification387.3.1. Transmission line design387.3.2. Transmission line measurements397.4. GSM Antenna - Installation Guidelines418. Logic level specifications428.1. Reset signal439. Serial Ports449.1. MODEM SERIAL PORT449.2. RS232 level translation469.3. UART Behaviour4910. Audio Section Overview5010.1. Electrical Characteristics5110.1.1. Input Lines5110.1.2. Output Lines5211. General Purpose I/O5311.1. GPIO Logic levels5411.2. Using a GPIO Pad as INPUT5511.3. Using a GPIO Pad as OUTPUT5511.4. Using the RF Transmission Control GPIO45511.5. Using the RFTXMON Output GPIO55611.6. Using the Alarm Output GPIO65611.7. Using the Buzzer Output GPIO75611.8. Indication of network service availability5711.9. RTC Bypass out5811.10. External SIM Holder Implementation5812. DAC and ADC section5912.1. DAC Converter5912.1.1. Description5912.1.2. Enabling DAC6012.1.3. Low Pass Filter Example6012.2. ADC Converter6112.2.1. Description6112.2.2. Using ADC Converter6113. Mounting the GE865 on your Board6213.1. General6213.2. Module finishing & dimensions62Recommended foot print for the application6313.4. Debug of the GE865 in production6413.5. Stencil6413.6. PCB pad design6513.7. Solder paste6613.7.1. GE865 Solder reflow6714. Packing system6914.1. Packing on tray6914.1.1. Tray detail7014.2. Packaging on reel7114.2.1. Carrier Tape detail7114.2.2. Reel detail7214.2.3. Packaging detail7314.3. Moisture sensibility7315. Conformity Assessment Issues7417. Document History77文件大小: 1.1 MB页数: 77Language: English打开用户手册