用户手册 (KC.64501.EE5)目录1 Introduction111.1 Processor Features121.2 Platform Features121.3 Terminology131.4 References151.5 Statement of Volatility152 Electrical Specifications172.1 Processor Signaling172.1.1 Intel® QuickPath Interconnect172.1.2 DDR3 Signal Groups172.1.3 Platform Environmental Control Interface (PECI)172.1.4 Processor Sideband Signals182.1.5 System Reference Clock182.1.6 Test Access Port (TAP) Signals192.1.7 Power / Other Signals192.1.8 Reserved or Unused Signals272.2 Signal Group Summary272.3 Mixing Processors292.4 Flexible Motherboard Guidelines (FMB)302.5 Absolute Maximum and Minimum Ratings302.6 Processor DC Specifications312.6.1 VCC Overshoot Specifications352.6.2 Die Voltage Validation362.7 Intel QuickPath Interconnect Specifications442.8 AC Specifications472.9 Processor AC Timing Waveforms543 Signal Quality Specifications653.1 Overshoot/Undershoot Tolerance654 Package Mechanical Specifications674.1 Package Mechanical Specifications674.1.1 Package Mechanical Drawing674.1.2 Processor Component Keep-Out Zones704.1.3 Package Loading Specifications704.1.4 Package Handling Guidelines704.1.5 Package Insertion Specifications704.1.6 Processor Mass Specification714.1.7 Processor Materials714.1.8 Processor Markings715 Land Listing735.1 Listing by Land Name735.2 Listing by Land Number906 Signal Definitions1096.1 Signal Definitions1097 Thermal Specifications1137.1 Package Thermal Specifications1137.1.1 Thermal Specifications1137.1.2 Thermal Metrology1287.2 Processor Thermal Features1287.2.1 Processor Temperature1287.2.2 Adaptive Thermal Monitor1297.2.3 On-Demand Mode1317.2.4 PROCHOT# Signal1317.2.5 THERMTRIP# Signal1327.3 Platform Environment Control Interface (PECI)1327.3.1 PECI Client Capabilities1337.3.2 Client Command Suite1347.3.3 Multi-Domain Commands1537.3.4 Client Responses1537.3.5 Originator Responses1557.3.6 Temperature Data1557.3.7 Client Management1567.4 Storage Conditions Specifications1588 Features1618.1 Power-On Configuration (POC)1618.2 Clock Control and Low Power States1628.2.1 Thread and Core Power State Descriptions1638.2.2 Package Power State Descriptions1648.2.3 Intel Xeon Processor 5600 Series C-State Power Specifications1658.3 Sleep States1658.4 Intel® Turbo Boost Technology1668.5 Enhanced Intel SpeedStep® Technology1669 Boxed Processor Specifications1679.1 Introduction1679.1.1 Available Boxed Thermal Solution Configurations1679.1.2 Intel® Thermal Solution STS100C (Passive/Active Combination Heat Sink Solution)1679.1.3 Intel Thermal Solution STS100A (Active Heat Sink Solution)1689.1.4 Intel Thermal Solution STS100P (Boxed 25.5 mm Tall Passive Heat Sink Solution)1699.2 Mechanical Specifications1699.2.1 Boxed Processor Heat Sink Dimensions and Baseboard Keepout Zones1709.2.2 Boxed Processor Retention Mechanism and Heat Sink Support (URS)1799.3 Fan Power Supply [STS100C (Combo) and STS100A (Active) Solutions]1809.3.1 Boxed Processor Cooling Requirements1819.4 Boxed Processor Contents183文件大小： 2.9 MB页数： 184Language: English打开用户手册
用户手册 (KC.60601.EE5)目录1 Introduction111.1 Processor Features121.2 Platform Features121.3 Terminology131.4 References151.5 Statement of Volatility152 Electrical Specifications172.1 Processor Signaling172.1.1 Intel® QuickPath Interconnect172.1.2 DDR3 Signal Groups172.1.3 Platform Environmental Control Interface (PECI)172.1.4 Processor Sideband Signals182.1.5 System Reference Clock182.1.6 Test Access Port (TAP) Signals192.1.7 Power / Other Signals192.1.8 Reserved or Unused Signals272.2 Signal Group Summary272.3 Mixing Processors292.4 Flexible Motherboard Guidelines (FMB)302.5 Absolute Maximum and Minimum Ratings302.6 Processor DC Specifications312.6.1 VCC Overshoot Specifications352.6.2 Die Voltage Validation362.7 Intel QuickPath Interconnect Specifications442.8 AC Specifications472.9 Processor AC Timing Waveforms543 Signal Quality Specifications653.1 Overshoot/Undershoot Tolerance654 Package Mechanical Specifications674.1 Package Mechanical Specifications674.1.1 Package Mechanical Drawing674.1.2 Processor Component Keep-Out Zones704.1.3 Package Loading Specifications704.1.4 Package Handling Guidelines704.1.5 Package Insertion Specifications704.1.6 Processor Mass Specification714.1.7 Processor Materials714.1.8 Processor Markings715 Land Listing735.1 Listing by Land Name735.2 Listing by Land Number906 Signal Definitions1096.1 Signal Definitions1097 Thermal Specifications1137.1 Package Thermal Specifications1137.1.1 Thermal Specifications1137.1.2 Thermal Metrology1287.2 Processor Thermal Features1287.2.1 Processor Temperature1287.2.2 Adaptive Thermal Monitor1297.2.3 On-Demand Mode1317.2.4 PROCHOT# Signal1317.2.5 THERMTRIP# Signal1327.3 Platform Environment Control Interface (PECI)1327.3.1 PECI Client Capabilities1337.3.2 Client Command Suite1347.3.3 Multi-Domain Commands1537.3.4 Client Responses1537.3.5 Originator Responses1557.3.6 Temperature Data1557.3.7 Client Management1567.4 Storage Conditions Specifications1588 Features1618.1 Power-On Configuration (POC)1618.2 Clock Control and Low Power States1628.2.1 Thread and Core Power State Descriptions1638.2.2 Package Power State Descriptions1648.2.3 Intel Xeon Processor 5600 Series C-State Power Specifications1658.3 Sleep States1658.4 Intel® Turbo Boost Technology1668.5 Enhanced Intel SpeedStep® Technology1669 Boxed Processor Specifications1679.1 Introduction1679.1.1 Available Boxed Thermal Solution Configurations1679.1.2 Intel® Thermal Solution STS100C (Passive/Active Combination Heat Sink Solution)1679.1.3 Intel Thermal Solution STS100A (Active Heat Sink Solution)1689.1.4 Intel Thermal Solution STS100P (Boxed 25.5 mm Tall Passive Heat Sink Solution)1699.2 Mechanical Specifications1699.2.1 Boxed Processor Heat Sink Dimensions and Baseboard Keepout Zones1709.2.2 Boxed Processor Retention Mechanism and Heat Sink Support (URS)1799.3 Fan Power Supply [STS100C (Combo) and STS100A (Active) Solutions]1809.3.1 Boxed Processor Cooling Requirements1819.4 Boxed Processor Contents183文件大小： 2.9 MB页数： 184Language: English打开用户手册
