用户手册 — AMD Sempron 3000 tray S754

目录

• 1 Overview

  13
  • 1.1 QuantiSpeed™ Architecture Summary

    14
• 2 Interface Signals

  17
  • 2.1 Overview

    17
  • 2.2 Signaling Technology

    17
  • 2.3 Push-Pull (PP) Drivers

    18
  • 2.4 AMD Athlon™ System Bus Signals

    18
• 3 Logic Symbol Diagram

  19
• 4 Power Management

  21
  • 4.1 Power Management States

    21
  • 4.2 Connect and Disconnect Protocol

    24
  • 4.3 Clock Control

    30
• 5 CPUID Support

  31
• 6 333 FSB AMD Sempron™ Processor Model 10 Specifications

  33
  • 6.1 Electrical and Thermal Specifications for the 333 FSB AMD Sempron™ Processor Model 10

    33
  • 6.2 333 FSB AMD Sempron™ Processor Model 10 SYSCLK and SYSCLK# AC Characteristics

    34
  • 6.3 333 FSB AMD Athlon™ System Bus AC Characteristics

    35
  • 6.4 333 FSB AMD Athlon™ System Bus DC Characteristics

    36
• 7 Electrical Data

  37
  • 7.1 Conventions

    37
  • 7.2 Interface Signal Groupings

    37
  • 7.3 Voltage Identification (VID[4:0])

    38
  • 7.4 Frequency Identification (FID[3:0])

    39
  • 7.5 VCCA AC and DC Characteristics

    39
  • 7.6 Decoupling

    39
  • 7.7 VCC_CORE Characteristics

    40
  • 7.8 Absolute Ratings

    42
  • 7.9 SYSCLK and SYSCLK# DC Characteristics

    43
  • 7.10 General AC and DC Characteristics

    44
  • 7.11 Open Drain Test Circuit

    46
  • 7.12 Thermal Diode Characteristics

    47
  • 7.13 APIC Pins AC and DC Characteristics

    49
• 8 Signal and Power-Up Requirements

  51
  • 8.1 Power-Up Requirements

    51
  • 8.2 Processor Warm Reset Requirements

    54
• 9 Mechanical Data

  55
  • 9.1 Die Loading

    55
  • 9.2 AMD Sempron™ Processor Model 10 Part Number 27488 OPGA Package Dimensions

    56
  • 9.3 AMD Sempron™ Processor Model 10 Part Number 27493 OPGA Package Dimensions

    58
• 10 Pin Descriptions

  61
  • 10.1 Pin Diagram and Pin Name Abbreviations

    61
  • 10.2 Pin List

    71
  • 10.3 Detailed Pin Descriptions

    80
• 11 Ordering Information

  89