用户手册 — Freescale Semiconductor Freedom Platform Evaluation Board for KL02Z-Family FRDM-KL02Z

目录

• Ordering parts

  3
• 1.1 Determining valid orderable parts

  3
• Part identification

  3
• 2.1 Description

  3
• 2.2 Format

  3
• 2.3 Fields

  3
• 2.4 Example

  4
• Small package marking

  4
• Terminology and guidelines

  5
• 4.1 Definition: Operating requirement

  5
• 4.2 Definition: Operating behavior

  5
• 4.3 Definition: Attribute

  5
• 4.4 Definition: Rating

  6
• 4.5 Result of exceeding a rating

  6
• requirements

  6
• 4.7 Guidelines for ratings and operating requirements

  7
• 4.8 Definition: Typical value

  7
• 4.9 Typical value conditions

  8
• Ratings

  9
• 5.1 Thermal handling ratings

  9
• 5.2 Moisture handling ratings

  9
• 5.3 ESD handling ratings

  9
• 5.4 Voltage and current operating ratings

  10
• General

  10
• 6.1 AC electrical characteristics

  10
• 6.2 Nonswitching electrical specifications

  10
• Voltage and current operating requirements

  11
• LVD and POR operating requirements

  11
• Voltage and current operating behaviors

  12
• Power mode transition operating behaviors

  13
• Power consumption operating behaviors

  13
• EMC radiated emissions operating behaviors

  19
• Designing with radiated emissions in mind

  20
• Capacitance attributes

  20
• 6.3 Switching specifications

  20
• Device clock specifications

  20
• General switching specifications

  21
• 6.4 Thermal specifications

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• Thermal operating requirements

  21
• Thermal attributes

  21
• Peripheral operating requirements and behaviors

  22
• 7.1 Core modules

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• SWD electricals

  22
• 7.2 System modules

  23
• 7.3 Clock modules

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• MCG specifications

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• 7.3.2 Oscillator electrical specifications

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• 7.4 Memories and memory interfaces

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• Flash electrical specifications

  26
• 7.5 Security and integrity modules

  28
• 7.6 Analog

  28
• ADC electrical specifications

  28
• CMP and 6-bit DAC electrical specifications

  31
• 7.7 Timers

  33
• 7.8 Communication interfaces

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• SPI switching specifications

  33
• I2C

  37
• UART

  37
• Dimensions

  38
• 8.1 Obtaining package dimensions

  38
• Pinout

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• 9.1 KL02 signal multiplexing and pin assignments

  38
• 9.2 KL02 pinouts

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• 10 Revision history

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