用户手册 — Freescale Semiconductor MPC830x PowerQUICC II Pro Processor Evaluation Kit MPC8309-KIT

目录

• 1 Overview

  2
  • 1.1 Features

    3
• 2 Electrical characteristics

  7
  • 2.1 Overall DC electrical characteristics

    8
  • 2.2 Power sequencing

    10
• 3 Power characteristics

  11
• 4 Clock input timing

  12
  • 4.1 DC electrical characteristics

    12
  • 4.2 AC electrical characteristics

    13
• 5 RESET initialization

  13
  • 5.1 Reset signals DC electrical characteristics

    14
• 6 DDR2 SDRAM

  14
  • 6.1 DDR2 SDRAM DC electrical characteristics

    14
  • 6.2 DDR2 SDRAM AC electrical characteristics

    15
• 7 Enhanced local bus

  19
  • 7.1 Enhanced local bus DC electrical characteristics

    19
  • 7.2 Enhanced local bus AC electrical specifications

    19
• 8 Ethernet and MII management

  22
  • 8.1 Ethernet controller (10/100 Mbps)-MII/RMII electrical characteristics

    22
  • 8.2 MII and RMII AC timing specifications

    23
  • 8.3 Ethernet management interface electrical characteristics

    27
• 9 TDM/SI

  29
  • 9.1 TDM/SI DC electrical characteristics

    29
  • 9.2 TDM/SI AC timing specifications

    29
• 10 HDLC

  30
  • 10.1 HDLC DC electrical characteristics

    30
  • 10.2 HDLC AC timing specifications

    30
• 11 PCI

  32
  • 11.1 PCI DC electrical characteristics

    32
  • 11.2 PCI AC electrical specifications

    32
• 12 USB

  34
  • 12.1 USB controller

    34
• 13 DUART

  36
  • 13.1 DUART DC electrical characteristics

    36
  • 13.2 DUART AC electrical specifications

    36
• 14 eSDHC

  37
  • 14.1 eSDHC DC electrical characteristics

    37
  • 14.2 eSDHC AC timing specifications

    37
• 15 FlexCAN

  39
  • 15.1 FlexCAN DC electrical characteristics

    39
  • 15.2 FlexCAN AC timing specifications

    39
• 16 I2C

  40
  • 16.1 I2C DC electrical characteristics

    40
  • 16.2 I2C AC electrical specifications

    40
• 17 Timers

  42
  • 17.1 Timer DC electrical characteristics

    42
  • 17.2 Timer AC timing specifications

    42
• 18 GPIO

  43
  • 18.1 GPIO DC electrical characteristics

    43
  • 18.2 GPIO AC timing specifications

    43
• 19 IPIC

  44
  • 19.1 IPIC DC electrical characteristics

    44
  • 19.2 IPIC AC timing specifications

    44
• 20 SPI

  44
  • 20.1 SPI DC electrical characteristics

    44
  • 20.2 SPI AC timing specifications

    45
• 21 JTAG

  46
  • 21.1 JTAG DC electrical characteristics

    46
  • 21.2 JTAG AC electrical characteristics

    47
• 22 Package and pin listings

  50
  • 22.1 Package parameters for the MPC8309

    50
  • 22.2 Mechanical dimensions of the MPC8309 MAPBGA

    50
  • 22.3 Pinout listings

    52
• 23 Clocking

  63
  • 23.1 Clocking in PCI host mode

    64
  • 23.2 Clocking in PCI agent mode

    64
  • 23.3 System clock domains

    64
  • 23.4 System PLL configuration

    66
  • 23.5 Core PLL configuration

    67
  • 23.6 QUICC Engine PLL configuration

    68
  • 23.7 Suggested PLL configurations

    69
• 24 Thermal

  70
  • 24.1 Thermal characteristics

    70
  • 24.2 Heat sink attachment

    72
• 25 System design information

  73
  • 25.1 System clocking

    73
  • 25.2 PLL power supply filtering

    74
  • 25.3 Decoupling recommendations

    74
  • 25.4 Output buffer DC impedance

    75
  • 25.5 Configuration pin multiplexing

    76
• 26 Ordering information

  76
  • 26.1 Part numbers fully addressed by this document

    76
  • 26.2 Part marking

    77
• 27 Document revision history

  78