用户手册 — HTC America Telephone Andes

目录

• 1. INTRODUCTION

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• 2. PRODUCT SPECIFICATIONS

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• 2.1 PRODUCT CONFIGURATION

  5
• 2.2 SPECIFICATIONS OF PDA PHONE II

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• 2.3 SPECIFICATIONS OF AC ADAPTER

  6
• 2.4 GSM/GPRS FUNCTIONAL BLOCK PART

  6
• 3. SYSTEM BLOCK DIAGRAM

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• 4. LABELING

  12
• 5. SERVICING TOOLS

  14
• 6. ASSEMBLING AND DISASSEMBLING

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• 6.1 DISASSEMBLING

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• 6.2 ASSEMBLING

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• 6.3 Camera Replacement assembly

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• 6.4 Connector, Back up battery replacement

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• 7. PROBLEM DIAGNOSTICS

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• 7.1 LIST OF TEST JIGS

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• 7.2 H/W REQUIREMENT FOR PC

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• 7.3 SOFTWARE REQUIREMENT

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• 8. DIAGNOSTIC PROGRAMS

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• 8.1 LIST OF TEST ITEMS

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• 8.2 TEST ITEMS OPERATION

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• 9. BATTERY TEST/JUDGEMENT PROCEDURE

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• 10.LCM INSPECTION CRITERIA

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• 11.RF

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• 11.1 RF TEST REQUIREMENT

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• 11.2 RF TEST PICTURE

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• 11.3 RF ANTENNA TEST SPEC.

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• 12. OS UPGRADE AND GSM CODE UPGRADE

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• 12.1 RUU

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• 12.2 RSU

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• 12.3 COMPLETE PROCEDURE FOR SD REFLASH

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• 13. CLASSIFICATION OF NON CONFIRMITY

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• 14.TROUBLE SHOOTING AND REPAIR

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• 15 EXPLODED DIAGRAMS& SPARE PART LIST

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• 15.1 Exploded Diagrams

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• 15.2 LIST OF SPAR PARTS

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• 14.APPENDIX

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• A. CUSTOMER, RETAILER MISJUDGMENT

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• 4END

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