用户手册目录Description3Feature3Ordering Information3Key Parameters4Speed Grade4Address Table4Pin Descriptions5Input/Output Functional Descriptions6Pin Assignments8On DIMM Thermal Sensor10Connection of Thermal Sensor10Temperature-to-Digital Conversion Performance10Functional Block Diagram112GB, 256Mx72 Module(1Rank of x8)114GB, 512Mx72 Module(2Rank of x8)12Absolute Maximum Ratings13Absolute Maximum DC Ratings13DRAM Component Operating Temperature Range13AC & DC Operating Conditions14Recommended DC Operating Conditions14AC & DC Input Measurement Levels16AC and DC Input Levels for Single-Ended Command and Address Signals16AC and DC Input Levels for Single-Ended Signals17Vref Tolerances18AC and DC Logic Input Levels for Differential Signals19Differential signal definition19Differential swing requirements for clock (CK - CK) and strobe (DQS-DQS)20Single-ended requirements for differential signals21Differential Input Cross Point Voltage23Slew Rate Definitions for Single-Ended Input Signals24Slew Rate Definitions for Differential Input Signals24AC & DC Output Measurement Levels25Single Ended AC and DC Output Levels25Differential AC and DC Output Levels25Single Ended Output Slew Rate26Differential Output Slew Rate27Reference Load for AC Timing and Output Slew Rate28Overshoot and Undershoot Specifications29Address and Control Overshoot and Undershoot Specifications29Clock, Data, Strobe and Mask Overshoot and Undershoot Specifications30Refresh parameters by device density31Standard Speed Bins32DDR3L-800 Speed Bins32DDR3L-1066 Speed Bins33DDR3L-1333 Speed Bins34DDR3L-1600 Speed Bins35Speed Bin Table Notes36Environmental Parameters37IDD and IDDQ Specification Parameters and Test Conditions38IDD Specifications (Tcase: 0 to 95oC)502GB, 256M x 72 U-DIMM: HMT325U7CFR8A504GB, 512M x 72 U-DIMM: HMT351U7CFR8A50Module Dimensions51256Mx72 - HMT325U7CFR8A51512Mx72 - HMT351U7CFR8A52文件大小： 1007.7 KB页数： 52Language: English打开用户手册
