用户手册 (81Y5944)目录1 Introduction111.1 Processor Features121.2 Platform Features121.3 Terminology131.4 References152 Electrical Specifications172.1 Processor Signaling172.1.1 Intel® QuickPath Interconnect172.1.2 DDR3 Signal Groups172.1.3 Platform Environmental Control Interface (PECI)172.1.4 Processor Sideband Signals182.1.5 System Reference Clock182.1.6 Test Access Port (TAP) Signals192.1.7 Power / Other Signals202.1.8 Reserved or Unused Signals272.2 Signal Group Summary282.3 Mixing Processors292.4 Flexible Motherboard Guidelines (FMB)302.5 Absolute Maximum and Minimum Ratings312.6 Processor DC Specifications322.6.1 VCC Overshoot Specifications352.6.2 Die Voltage Validation362.7 Intel® QuickPath Interconnect Specifications472.8 AC Specifications492.9 Processor AC Timing Waveforms563 Signal Quality Specifications673.1 Overshoot/Undershoot Tolerance674 Package Mechanical Specifications694.1 Package Mechanical Specifications694.1.1 Package Mechanical Drawing704.1.2 Processor Component Keep-Out Zones734.1.3 Package Loading Specifications734.1.4 Package Handling Guidelines734.1.5 Package Insertion Specifications734.1.6 Processor Mass Specification744.1.7 Processor Materials744.1.8 Processor Markings745 Land Listing755.1 Listing by Land Name755.2 Listing by Land Number926 Signal Definitions1116.1 Signal Definitions1117 Thermal Specifications1157.1 Package Thermal Specifications1157.1.1 Thermal Specifications1157.1.2 Thermal Metrology1307.2 Processor Thermal Features1307.2.1 Processor Temperature1307.2.2 Adaptive Thermal Monitor1317.2.3 On-Demand Mode1337.2.4 PROCHOT# Signal1337.2.5 THERMTRIP# Signal1347.3 Platform Environment Control Interface (PECI)1347.3.1 PECI Client Capabilities1357.3.2 Client Command Suite1367.3.3 Multi-Domain Commands1557.3.4 Client Responses1557.3.5 Originator Responses1577.3.6 Temperature Data1577.3.7 Client Management1587.4 Storage Conditions Specifications1608 Features1638.1 Power-On Configuration (POC)1638.2 Clock Control and Low Power States1648.2.1 Thread and Core Power State Descriptions1658.2.2 Package Power State Descriptions1668.2.3 Intel Xeon Processor 5600 Series C-State Power Specifications1678.3 Sleep States1678.4 Intel® Turbo Boost Technology1688.5 Enhanced Intel SpeedStep® Technology1689 Boxed Processor Specifications1699.1 Introduction1699.1.1 Available Boxed Thermal Solution Configurations1699.1.2 Intel Thermal Solution STS100C (Passive/Active Combination Heat Sink Solution)1699.1.3 Intel Thermal Solution STS100A (Active Heat Sink Solution)1709.1.4 Intel Thermal Solution STS100P (Boxed 25.5 mm Tall Passive Heat Sink Solution)1719.2 Mechanical Specifications1719.2.1 Boxed Processor Heat Sink Dimensions and Baseboard Keepout Zones1729.2.2 Boxed Processor Retention Mechanism and Heat Sink Support (URS)1819.3 Fan Power Supply [STS100C (Combo) and STS100A (Active) Solutions]1829.3.1 Boxed Processor Cooling Requirements1839.4 Boxed Processor Contents185文件大小： 2.2 MB页数： 186Language: English打开用户手册
用户手册 (81Y9325)目录1 Introduction111.1 Processor Features121.2 Platform Features121.3 Terminology131.4 References152 Electrical Specifications172.1 Processor Signaling172.1.1 Intel® QuickPath Interconnect172.1.2 DDR3 Signal Groups172.1.3 Platform Environmental Control Interface (PECI)172.1.4 Processor Sideband Signals182.1.5 System Reference Clock182.1.6 Test Access Port (TAP) Signals192.1.7 Power / Other Signals202.1.8 Reserved or Unused Signals272.2 Signal Group Summary282.3 Mixing Processors292.4 Flexible Motherboard Guidelines (FMB)302.5 Absolute Maximum and Minimum Ratings312.6 Processor DC Specifications322.6.1 VCC Overshoot Specifications352.6.2 Die Voltage Validation362.7 Intel® QuickPath Interconnect Specifications472.8 AC Specifications492.9 Processor AC Timing Waveforms563 Signal Quality Specifications673.1 Overshoot/Undershoot Tolerance674 Package Mechanical Specifications694.1 Package Mechanical Specifications694.1.1 Package Mechanical Drawing704.1.2 Processor Component Keep-Out Zones734.1.3 Package Loading Specifications734.1.4 Package Handling Guidelines734.1.5 Package Insertion Specifications734.1.6 Processor Mass Specification744.1.7 Processor Materials744.1.8 Processor Markings745 Land Listing755.1 Listing by Land Name755.2 Listing by Land Number926 Signal Definitions1116.1 Signal Definitions1117 Thermal Specifications1157.1 Package Thermal Specifications1157.1.1 Thermal Specifications1157.1.2 Thermal Metrology1307.2 Processor Thermal Features1307.2.1 Processor Temperature1307.2.2 Adaptive Thermal Monitor1317.2.3 On-Demand Mode1337.2.4 PROCHOT# Signal1337.2.5 THERMTRIP# Signal1347.3 Platform Environment Control Interface (PECI)1347.3.1 PECI Client Capabilities1357.3.2 Client Command Suite1367.3.3 Multi-Domain Commands1557.3.4 Client Responses1557.3.5 Originator Responses1577.3.6 Temperature Data1577.3.7 Client Management1587.4 Storage Conditions Specifications1608 Features1638.1 Power-On Configuration (POC)1638.2 Clock Control and Low Power States1648.2.1 Thread and Core Power State Descriptions1658.2.2 Package Power State Descriptions1668.2.3 Intel Xeon Processor 5600 Series C-State Power Specifications1678.3 Sleep States1678.4 Intel® Turbo Boost Technology1688.5 Enhanced Intel SpeedStep® Technology1689 Boxed Processor Specifications1699.1 Introduction1699.1.1 Available Boxed Thermal Solution Configurations1699.1.2 Intel Thermal Solution STS100C (Passive/Active Combination Heat Sink Solution)1699.1.3 Intel Thermal Solution STS100A (Active Heat Sink Solution)1709.1.4 Intel Thermal Solution STS100P (Boxed 25.5 mm Tall Passive Heat Sink Solution)1719.2 Mechanical Specifications1719.2.1 Boxed Processor Heat Sink Dimensions and Baseboard Keepout Zones1729.2.2 Boxed Processor Retention Mechanism and Heat Sink Support (URS)1819.3 Fan Power Supply [STS100C (Combo) and STS100A (Active) Solutions]1829.3.1 Boxed Processor Cooling Requirements1839.4 Boxed Processor Contents185文件大小： 2.2 MB页数： 186Language: English打开用户手册
用户手册 (49Y3769)目录1 Introduction111.1 Processor Features121.2 Platform Features121.3 Terminology131.4 References152 Electrical Specifications172.1 Processor Signaling172.1.1 Intel® QuickPath Interconnect172.1.2 DDR3 Signal Groups172.1.3 Platform Environmental Control Interface (PECI)172.1.4 Processor Sideband Signals182.1.5 System Reference Clock182.1.6 Test Access Port (TAP) Signals192.1.7 Power / Other Signals202.1.8 Reserved or Unused Signals272.2 Signal Group Summary282.3 Mixing Processors292.4 Flexible Motherboard Guidelines (FMB)302.5 Absolute Maximum and Minimum Ratings312.6 Processor DC Specifications322.6.1 VCC Overshoot Specifications352.6.2 Die Voltage Validation362.7 Intel® QuickPath Interconnect Specifications472.8 AC Specifications492.9 Processor AC Timing Waveforms563 Signal Quality Specifications673.1 Overshoot/Undershoot Tolerance674 Package Mechanical Specifications694.1 Package Mechanical Specifications694.1.1 Package Mechanical Drawing704.1.2 Processor Component Keep-Out Zones734.1.3 Package Loading Specifications734.1.4 Package Handling Guidelines734.1.5 Package Insertion Specifications734.1.6 Processor Mass Specification744.1.7 Processor Materials744.1.8 Processor Markings745 Land Listing755.1 Listing by Land Name755.2 Listing by Land Number926 Signal Definitions1116.1 Signal Definitions1117 Thermal Specifications1157.1 Package Thermal Specifications1157.1.1 Thermal Specifications1157.1.2 Thermal Metrology1307.2 Processor Thermal Features1307.2.1 Processor Temperature1307.2.2 Adaptive Thermal Monitor1317.2.3 On-Demand Mode1337.2.4 PROCHOT# Signal1337.2.5 THERMTRIP# Signal1347.3 Platform Environment Control Interface (PECI)1347.3.1 PECI Client Capabilities1357.3.2 Client Command Suite1367.3.3 Multi-Domain Commands1557.3.4 Client Responses1557.3.5 Originator Responses1577.3.6 Temperature Data1577.3.7 Client Management1587.4 Storage Conditions Specifications1608 Features1638.1 Power-On Configuration (POC)1638.2 Clock Control and Low Power States1648.2.1 Thread and Core Power State Descriptions1658.2.2 Package Power State Descriptions1668.2.3 Intel Xeon Processor 5600 Series C-State Power Specifications1678.3 Sleep States1678.4 Intel® Turbo Boost Technology1688.5 Enhanced Intel SpeedStep® Technology1689 Boxed Processor Specifications1699.1 Introduction1699.1.1 Available Boxed Thermal Solution Configurations1699.1.2 Intel Thermal Solution STS100C (Passive/Active Combination Heat Sink Solution)1699.1.3 Intel Thermal Solution STS100A (Active Heat Sink Solution)1709.1.4 Intel Thermal Solution STS100P (Boxed 25.5 mm Tall Passive Heat Sink Solution)1719.2 Mechanical Specifications1719.2.1 Boxed Processor Heat Sink Dimensions and Baseboard Keepout Zones1729.2.2 Boxed Processor Retention Mechanism and Heat Sink Support (URS)1819.3 Fan Power Supply [STS100C (Combo) and STS100A (Active) Solutions]1829.3.1 Boxed Processor Cooling Requirements1839.4 Boxed Processor Contents185文件大小： 2.2 MB页数： 186Language: English打开用户手册
用户手册 (49Y3774)目录1 Introduction111.1 Processor Features121.2 Platform Features121.3 Terminology131.4 References152 Electrical Specifications172.1 Processor Signaling172.1.1 Intel® QuickPath Interconnect172.1.2 DDR3 Signal Groups172.1.3 Platform Environmental Control Interface (PECI)172.1.4 Processor Sideband Signals182.1.5 System Reference Clock182.1.6 Test Access Port (TAP) Signals192.1.7 Power / Other Signals202.1.8 Reserved or Unused Signals272.2 Signal Group Summary282.3 Mixing Processors292.4 Flexible Motherboard Guidelines (FMB)302.5 Absolute Maximum and Minimum Ratings312.6 Processor DC Specifications322.6.1 VCC Overshoot Specifications352.6.2 Die Voltage Validation362.7 Intel® QuickPath Interconnect Specifications472.8 AC Specifications492.9 Processor AC Timing Waveforms563 Signal Quality Specifications673.1 Overshoot/Undershoot Tolerance674 Package Mechanical Specifications694.1 Package Mechanical Specifications694.1.1 Package Mechanical Drawing704.1.2 Processor Component Keep-Out Zones734.1.3 Package Loading Specifications734.1.4 Package Handling Guidelines734.1.5 Package Insertion Specifications734.1.6 Processor Mass Specification744.1.7 Processor Materials744.1.8 Processor Markings745 Land Listing755.1 Listing by Land Name755.2 Listing by Land Number926 Signal Definitions1116.1 Signal Definitions1117 Thermal Specifications1157.1 Package Thermal Specifications1157.1.1 Thermal Specifications1157.1.2 Thermal Metrology1307.2 Processor Thermal Features1307.2.1 Processor Temperature1307.2.2 Adaptive Thermal Monitor1317.2.3 On-Demand Mode1337.2.4 PROCHOT# Signal1337.2.5 THERMTRIP# Signal1347.3 Platform Environment Control Interface (PECI)1347.3.1 PECI Client Capabilities1357.3.2 Client Command Suite1367.3.3 Multi-Domain Commands1557.3.4 Client Responses1557.3.5 Originator Responses1577.3.6 Temperature Data1577.3.7 Client Management1587.4 Storage Conditions Specifications1608 Features1638.1 Power-On Configuration (POC)1638.2 Clock Control and Low Power States1648.2.1 Thread and Core Power State Descriptions1658.2.2 Package Power State Descriptions1668.2.3 Intel Xeon Processor 5600 Series C-State Power Specifications1678.3 Sleep States1678.4 Intel® Turbo Boost Technology1688.5 Enhanced Intel SpeedStep® Technology1689 Boxed Processor Specifications1699.1 Introduction1699.1.1 Available Boxed Thermal Solution Configurations1699.1.2 Intel Thermal Solution STS100C (Passive/Active Combination Heat Sink Solution)1699.1.3 Intel Thermal Solution STS100A (Active Heat Sink Solution)1709.1.4 Intel Thermal Solution STS100P (Boxed 25.5 mm Tall Passive Heat Sink Solution)1719.2 Mechanical Specifications1719.2.1 Boxed Processor Heat Sink Dimensions and Baseboard Keepout Zones1729.2.2 Boxed Processor Retention Mechanism and Heat Sink Support (URS)1819.3 Fan Power Supply [STS100C (Combo) and STS100A (Active) Solutions]1829.3.1 Boxed Processor Cooling Requirements1839.4 Boxed Processor Contents185文件大小： 2.2 MB页数： 186Language: English打开用户手册
用户手册 (49Y3768)目录1 Introduction111.1 Processor Features121.2 Platform Features121.3 Terminology131.4 References152 Electrical Specifications172.1 Processor Signaling172.1.1 Intel® QuickPath Interconnect172.1.2 DDR3 Signal Groups172.1.3 Platform Environmental Control Interface (PECI)172.1.4 Processor Sideband Signals182.1.5 System Reference Clock182.1.6 Test Access Port (TAP) Signals192.1.7 Power / Other Signals202.1.8 Reserved or Unused Signals272.2 Signal Group Summary282.3 Mixing Processors292.4 Flexible Motherboard Guidelines (FMB)302.5 Absolute Maximum and Minimum Ratings312.6 Processor DC Specifications322.6.1 VCC Overshoot Specifications352.6.2 Die Voltage Validation362.7 Intel® QuickPath Interconnect Specifications472.8 AC Specifications492.9 Processor AC Timing Waveforms563 Signal Quality Specifications673.1 Overshoot/Undershoot Tolerance674 Package Mechanical Specifications694.1 Package Mechanical Specifications694.1.1 Package Mechanical Drawing704.1.2 Processor Component Keep-Out Zones734.1.3 Package Loading Specifications734.1.4 Package Handling Guidelines734.1.5 Package Insertion Specifications734.1.6 Processor Mass Specification744.1.7 Processor Materials744.1.8 Processor Markings745 Land Listing755.1 Listing by Land Name755.2 Listing by Land Number926 Signal Definitions1116.1 Signal Definitions1117 Thermal Specifications1157.1 Package Thermal Specifications1157.1.1 Thermal Specifications1157.1.2 Thermal Metrology1307.2 Processor Thermal Features1307.2.1 Processor Temperature1307.2.2 Adaptive Thermal Monitor1317.2.3 On-Demand Mode1337.2.4 PROCHOT# Signal1337.2.5 THERMTRIP# Signal1347.3 Platform Environment Control Interface (PECI)1347.3.1 PECI Client Capabilities1357.3.2 Client Command Suite1367.3.3 Multi-Domain Commands1557.3.4 Client Responses1557.3.5 Originator Responses1577.3.6 Temperature Data1577.3.7 Client Management1587.4 Storage Conditions Specifications1608 Features1638.1 Power-On Configuration (POC)1638.2 Clock Control and Low Power States1648.2.1 Thread and Core Power State Descriptions1658.2.2 Package Power State Descriptions1668.2.3 Intel Xeon Processor 5600 Series C-State Power Specifications1678.3 Sleep States1678.4 Intel® Turbo Boost Technology1688.5 Enhanced Intel SpeedStep® Technology1689 Boxed Processor Specifications1699.1 Introduction1699.1.1 Available Boxed Thermal Solution Configurations1699.1.2 Intel Thermal Solution STS100C (Passive/Active Combination Heat Sink Solution)1699.1.3 Intel Thermal Solution STS100A (Active Heat Sink Solution)1709.1.4 Intel Thermal Solution STS100P (Boxed 25.5 mm Tall Passive Heat Sink Solution)1719.2 Mechanical Specifications1719.2.1 Boxed Processor Heat Sink Dimensions and Baseboard Keepout Zones1729.2.2 Boxed Processor Retention Mechanism and Heat Sink Support (URS)1819.3 Fan Power Supply [STS100C (Combo) and STS100A (Active) Solutions]1829.3.1 Boxed Processor Cooling Requirements1839.4 Boxed Processor Contents185文件大小： 2.2 MB页数： 186Language: English打开用户手册
