用户手册 — IBM Intel Xeon L5420

目录

• 1 Introduction

  9
  • 1.1 Objective

    9
  • 1.2 Scope

    9
  • 1.3 References

    9
  • 1.4 Definition of Terms

    10
• 2 Thermal/Mechanical Reference Design

  13
  • 2.1 Mechanical Requirements

    13
    • 2.1.1 Processor Mechanical Parameters

      13
    • 2.1.2 Quad-Core Intel® Xeon® Processor 5400 Series Package

      14
    • 2.1.3 Quad-Core Intel® Xeon® Processor 5400 Series Considerations

      18
  • 2.2 Processor Thermal Parameters and Features

    19
    • 2.2.1 Thermal Control Circuit and TDP

      19
    • 2.2.2 Digital Thermal Sensor

      20
    • 2.2.3 Platform Environmental Control Interface (PECI)

      21
    • 2.2.4 Multiple Core Special Considerations

      21
    • 2.2.5 Thermal Profile

      24
    • 2.2.6 TCONTROL Definition

      25
    • 2.2.7 Thermal Profile Concepts for the Quad-Core Intel® Xeon® Processor 5400 Series

      26
    • 2.2.8 Performance Targets

      28
  • 2.3 Fan Fail Guidelines

    32
  • 2.4 Characterizing Cooling Solution Performance Requirements

    33
    • 2.4.1 Fan Speed Control

      33
    • 2.4.2 Processor Thermal Characterization Parameter Relationships

      34
    • 2.4.3 Chassis Thermal Design Considerations

      36
  • 2.5 Thermal/Mechanical Reference Design Considerations

    37
    • 2.5.1 Heatsink Solutions

      37
    • 2.5.2 Thermal Interface Material

      38
    • 2.5.3 Summary

      38
    • 2.5.4 Assembly Overview of the Intel Reference Thermal Mechanical Design

      39
    • 2.5.5 Thermal Solution Performance Characteristics

      41
    • 2.5.6 Thermal Profile Adherence

      42
    • 2.5.7 Components Overview

      45
    • 2.5.8 Boxed Active Thermal Solution for the Quad-Core Intel® Xeon® Processor 5400 Series Thermal Profile

      49
• A 1U Alternative Heatsink Thermal/Mechanical Design

  53
  • A.1 Component Overview

    53
  • A.2 Thermal Solution Performance Characterics

    54
  • A.3 Thermal Profile Adherence

    54
• B Mechanical Drawings

  57
• C Heatsink Clip Load Methodology

  83
  • C.1 Overview

    83
  • C.2 Test Preparation

    83
    • C.2.1 Heatsink Preparation

      83
    • C.2.2 Typical Test Equipment

      86
    • C.2.3 Test Procedure Examples

      86
    • C.2.4 Time-Zero, Room Temperature Preload Measurement

      86
    • C.2.5 Preload Degradation under Bake Conditions

      87
• D Safety Requirements

  89
• E Quality and Reliability Requirements

  91
  • E.1 Intel Verification Criteria for the Reference Designs

    91
    • E.1.1 Reference Heatsink Thermal Verification

      91
    • E.1.2 Environmental Reliability Testing

      91
    • E.1.3 Material and Recycling Requirements

      93
• F Enabled Suppliers Information

  95
  • F.1 Supplier Information

    95
    • F.1.1 Intel Enabled Suppliers

      95
    • F.1.2 Additional Suppliers

      96