用户手册 (LE80537UE0042ML)目录Contents31 Introduction71.1 Terminology91.2 References102 Low Power Features112.1 Clock Control and Low Power States112.1.1 Core Low Power State Descriptions132.1.1.1 Core C0 State132.1.1.2 Core C1/AutoHALT Powerdown State132.1.1.3 Core C1/MWAIT Powerdown State142.1.1.4 Core C2 State142.1.1.5 Core C3 State142.1.1.6 Core C4 State142.1.2 Package Low Power State Descriptions152.1.2.1 Normal State152.1.2.2 Stop-Grant State152.1.2.3 Stop-Grant Snoop State152.1.2.4 Sleep State152.1.2.5 Deep Sleep State162.1.2.6 Deeper Sleep State162.2 Enhanced Intel SpeedStep® Technology182.3 Extended Low Power States192.4 FSB Low Power Enhancements192.5 Processor Power Status Indicator (PSI#) Signal203 Electrical Specifications213.1 Power and Ground Pins213.2 FSB Clock (BCLK[1:0]) and Processor Clocking213.3 Voltage Identification213.4 Catastrophic Thermal Protection253.5 Reserved and Unused Pins253.6 FSB Frequency Select Signals (BSEL[2:0])263.7 FSB Signal Groups263.8 CMOS Signals283.9 Maximum Ratings283.10 Processor DC Specifications294 Package Mechanical Specifications and Pin Information394.1 Package Mechanical Specifications394.2 Processor Pinout and Pin List494.3 Alphabetical Signals Reference735 Thermal Specifications and Design Considerations815.1 Thermal Specifications855.1.1 Thermal Diode855.1.2 Thermal Diode Offset855.1.3 Intel® Thermal Monitor875.1.4 Digital Thermal Sensor895.1.5 Out of Specification Detection905.1.6 PROCHOT# Signal Pin90文件大小： 1.9 MB页数： 91Language: English打开用户手册
用户手册 (LE80537UE0042M)目录Contents31 Introduction71.1 Terminology91.2 References102 Low Power Features112.1 Clock Control and Low Power States112.1.1 Core Low Power State Descriptions132.1.1.1 Core C0 State132.1.1.2 Core C1/AutoHALT Powerdown State132.1.1.3 Core C1/MWAIT Powerdown State142.1.1.4 Core C2 State142.1.1.5 Core C3 State142.1.1.6 Core C4 State142.1.2 Package Low Power State Descriptions152.1.2.1 Normal State152.1.2.2 Stop-Grant State152.1.2.3 Stop-Grant Snoop State152.1.2.4 Sleep State152.1.2.5 Deep Sleep State162.1.2.6 Deeper Sleep State162.2 Enhanced Intel SpeedStep® Technology182.3 Extended Low Power States192.4 FSB Low Power Enhancements192.5 Processor Power Status Indicator (PSI#) Signal203 Electrical Specifications213.1 Power and Ground Pins213.2 FSB Clock (BCLK[1:0]) and Processor Clocking213.3 Voltage Identification213.4 Catastrophic Thermal Protection253.5 Reserved and Unused Pins253.6 FSB Frequency Select Signals (BSEL[2:0])263.7 FSB Signal Groups263.8 CMOS Signals283.9 Maximum Ratings283.10 Processor DC Specifications294 Package Mechanical Specifications and Pin Information394.1 Package Mechanical Specifications394.2 Processor Pinout and Pin List494.3 Alphabetical Signals Reference735 Thermal Specifications and Design Considerations815.1 Thermal Specifications855.1.1 Thermal Diode855.1.2 Thermal Diode Offset855.1.3 Intel® Thermal Monitor875.1.4 Digital Thermal Sensor895.1.5 Out of Specification Detection905.1.6 PROCHOT# Signal Pin90文件大小： 1.9 MB页数： 91Language: English打开用户手册
