用户手册 — Intel 200

目录

• 1 Introduction

  7
  • 1.1 Document Goals and Scope

    7
    • 1.1.1 Importance of Thermal Management

      7
    • 1.1.2 Document Goals

      7
    • 1.1.3 Document Scope

      8
  • 1.2 Reference Documents

    9
  • 1.3 Definition of Terms

    9
  • 3 Thermal Metrology

    27
    • 3.1 Characterizing Cooling Performance Requirements

      27
      • 3.1.1 Example

        29
    • 3.2 Local Ambient Temperature Measurement Guidelines

      30
    • 3.3 Processor Power Measurement Metrology Recommendation

      32
      • 3.3.1 Sample Preparation

        33
  • 4 System Thermal/Mechanical Design Information

    37
    • 4.1 Overview of the Reference Design

      37
      • 4.1.1 Altitude

        37
      • 4.1.2 Heatsink Thermal Validation

        37
    • 4.2 Environmental Reliability Testing

      38
      • 4.2.1 Structural Reliability Testing

        38
        • 4.2.1.1 Random Vibration Test Procedure

          38
        • 4.2.1.2 Shock Test Procedure

          38
      • 4.2.2 Power Cycling

        40
      • 4.2.3 Recommended BIOS/CPU/Memory Test Procedures

        40
    • 4.3 Material and Recycling Requirements

      40
    • 4.4 Safety Requirements

      41
    • 4.5 Reference Attach Mechanism

      41
      • 4.5.1 Structural Design Strategy

        41
      • 4.5.2 Mechanical Interface to the Reference Attach Mechanism

        41
• 2 Processor Thermal/Mechanical Information

  11
  • 2.1 Mechanical Requirements

    11
    • 2.1.1 Processor Package

      11
    • 2.1.2 Heatsink Attach

      16
      • 2.1.2.1 General Guidelines

        16
      • 2.1.2.2 Heatsink Clip Load Requirement

        16
      • 2.1.2.3 Heatsink Attach Mechanism Design Considerations

        17
  • 2.2 Thermal Requirements

    18
    • 2.2.1 Processor Junction Temperature

      19
  • 2.3 Heatsink Design Considerations

    19
    • 2.3.1 Heatsink Size

      20
    • 2.3.2 Heatsink Mass

      21
    • 2.3.3 Thermal Interface Material

      21
  • 2.4 System Thermal Solution Considerations

    22
    • 2.4.1 Chassis Thermal Design Capabilities

      22
    • 2.4.2 Improving Chassis Thermal Performance

      22
    • 2.4.3 Summary

      25